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ECTC Home | Sponsors | 76th ECTC Highlights

Submit your abstract for the 77th ECTC!

The premier international conference for electronics packaging, components, and microelectronics systems technology.

You are invited to submit an abstract about new developments and technology related to the following:

• Applied Reliability
• Assembly & Manufacturing Technology
• Emerging Technologies
• Electrical Design and Analysis
• Interconnections
• Materials & Processing
• Packaging Technologies
• Photonics
• Thermal/Mechanical Simulation & Characterization
• Interactive Presentations

See committee members.

Submission Guidelines

The content must be original, previously unpublished, non-confidential and without commercial content.
 
All abstracts must be submitted electronically at our website by 5 October 2026. Selected authors will be announced by 7 December 2026. The first 100 people to submit abstracts will be entered into a drawing to win a free ECTC 2027 registration.

Abstract Guidelines

Abstracts include a 50-word novelty paragraph, content of up to 700 words, and one optional table (or figure). All accepted papers will be presented during oral, interactive presentations or special student interactive presentations sessions.

For more information, please contact:
 
Tanja Braun
77th ECTC Program Chair
E-mail: Tanja.Braun@izm.fraunhofer.de 
 
Again, this year:

1. First-time submitting authors will be entered into a drawing to win a prize during the conference.
2. Furthermore, following the conference, a collection of outstanding papers may be selected (with appropriate revisions) for peer-reviewed publication in the prestigious IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Professional Development Courses

The 2027 ECTC PDC (Professional Development Courses) abstract submission is now open! A diverse array of PDCs will be offered on the first day of the conference (1 June). Renowned experts will conduct the PDCs, enabling participants to expand their technical expertise.
 
The Electronic Components and Technology Conference is the premier international symposium for presentations on electronic devices, materials, packaging, reliability, and design, sponsored by the EPS Society of the IEEE. You are invited to submit a proposal for a 4-hour educational short course that provides information on developments, technology and knowledge in the areas described in the ECTC Call for Papers. Please submit a 200-word course description, a course outline consisting of up to 16 bullet items, and a description of your target audience. The proposals must be received by 19 October 2026.

The submission of a proposal represents your commitment to present the course at the conference if your proposal is accepted. The PDC files will be distributed to registered PDC attendees starting on 28 May 2027.

For more information, please contact:
 
Kitty J. Pearsall
77th ECTC Professional Development Courses Chair
Capstan Technologies
Phone: +1-512-845-3287
Email: kitty.pearsall@gmail.com

Sponsorship Opportunities to Enhance Your Presence at ECTC

ECTC offers many unique sponsorship opportunities that provide highly visible exposure for your company. Additional information is available here.
 
For more information, please contact:
 
Alan Huffman, ECTC Sponsorship Chair
E-mail: alan.huffman@ieee.org; sponsorship@ectc.net

Exhibit at the ECTC: SOLD OUT – Waitlist Only

The ECTC Exhibition is proud to feature over 130 companies and organizations representing the full spectrum of materials, services, equipment, and products for the electronic packaging industry.
 
Complementing the strength of the ECTC technical program, the exhibition provides an unparalleled opportunity for engineers and decision-makers to engage with representatives from leading electronic packaging companies.
 
Exhibit space for ECTC 2027 is currently sold out. If you are interested in exhibiting, we encourage you to join our waitlist by contacting:
 
Chris Bower, ECTC Exhibits Chair
E-mail: at chris.bower@ectc.net, or Esther Colom at exhibits@ectc.net 

For more information on the 2027 ECTC visit www.ectc.net.

Also, see some of the 2026 ECTC Highlights.

Learn more about the packaging innovations and the ECTC role over the last 75 years here. 

Become an ECTC Sponsor: Don't miss this great opportunity!

See ECTC pictures via Flickr and be sure to join the ECTC via LinkedIn.

Thanks to Our 2026 Sponsors