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Certificate and Tracking for Your Order PO26371918
Delivered on Order PO26371918: Rounded Head Screws and 6 Other Items
Fwd: IMAPS 2026 Pre-event Attendee List
From: Leo Garvey <Leo@lfgmicro.com>
Date: Fri, Sep 18, 2026 at 8:58 AM
Subject: Fwd: IMAPS 2026 Pre-event Attendee List
To: Dave DeWire <DDewire@nanofea.com>, Chris Berger <CBerger@turnpack.com>
Leo Garvey
LFG Micro
631.399.3199
Representing & Distributing the BEST in microelectronics for 30+ years...
JFP Microtechnic➙ Manual & Semiautomatic Wire Bonders . Manual & Semiautomatic Die Bonders, Die Sort / Loaders, and Wafer Scribers
Kulicke & Soffa➙ Advanced Precision Dispensers. Piezo Jet . PCP . Deposition . Ultrasonic Spray
Kulicke & Soffa Wire Bonders➙ Auto Ball . Auto Wedge . Auto Wafer . Bonding Capillaries . Dicing Blades
LFG Micro➙ K&S 4500/5000 Service & Training . Custom Wire Pull Hooks . Short Run Package Delidding
Bonding Wire➙ Aluminum . Gold . Copper . Silver
Midas ➙ Hot Gas Rework Station . Hermetic Package Delidder
NEW LINE! NanoFEA➙ Targeted Getter Products & Services . Polar & Non-Polar Gases, Polar & Non-Polar VOC's, Particles
Stellar➙ Thermal Management DBC, Machined & Metalized Ceramic Substrates, & Micro Channel Liquid Coolers
This email and its contents are private and confidential between the sender and the individual(s) to whom it has been sent. The content of this email is non-binding and is subject to contract unless specifically stated otherwise.
From: Becky Roland <broland@imaps.org>
Date: Fri, Sep 18, 2026 at 10:35 AM
Subject: IMAPS 2026 Pre-event Attendee List
To:
|
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Becky Roland
International Microelectronics Assembly
and Packaging Society
PO Box 14727 | Pittsburgh, PA 15234 Try Chip, IMAPS new AI Assistant trained on all IMAPS content sources! |
von Chris Berger - 12:12 - 18 Sept. 2026
