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by "DMARC Aggregate Report" <dmarcreport@microsoft.com> - 03:56 - 25 Feb 2026 -
Invoice for Your Order PO26081607
InvoiceBilled toTURNPACK LLC
22425 S SCOTLAND CT STE 104
QUEEN CREEK AZ 85142Purchase Order PO26081607 Total $68.30 Invoice 60431465 Invoice Date 2/24/26 Payment Terms 2% 10, Net 30 Deduct $1.13 on merchandise if paid by 3/6/26. Shipped toAttention: Suite 104Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142Mail Payment to McMaster-Carr
PO Box 7690
Chicago IL 60680-7690Your Account 438808000 Christopher Berger placed this order.Line Product Ordered Shipped Balance Price Total 1 26355A43 High-Speed Steel Chip-Clearing Tap for Blind Holes, Uncoated, Plug Chamfer, M5 x 0.8 mm Thread Size 2 Each2 0 14.51 Each29.02 2 2841A12 Quick-Change Uncoated Carbide Drill Bit, 0.70 mm Size 2 Each2 0 7.27 Each14.54 3 92855A631 18-8 Stainless Steel Low-Profile Socket Head Screws with Hex Drive, M6 x 1 mm Thread, 40 mm Long, Packs of 10 2 Packs2 0 6.49 Per Pack12.98 Merchandise 56.54 Shipping 11.76 Total $68.30 Packing List Shipped Weight Carrier Tracking 3263819-01 02/24/2026 1 lb FedEx 512608317248 Federal ID 36-1458720
by "McMaster-Carr" <invoice.reply@mcmaster.com> - 03:12 - 25 Feb 2026 -
Your AutoPay Reminder
The Hartford
Don't miss important emails! Add businesscenter@mail.service.thehartford.com to your contacts.
info@turnpack.com Policy Number(s): 76WEGAX9Y65 Your Automatic Payment Will Draft Soon Dear Christopher, Just a reminder: your next automatic payment is scheduled for 03/16/26. If it falls on a weekend or bank holiday, your payment will draft on the next business day. Here's a summary of your payment: TURNKEY PACKAGING SOLUTIONS Bill Account Number: 17069928 Withdrawal Date: 03/16/26 Withdrawal Amount: $169.52 Need to see more information? Log In » This is for your*: Workers' Compensation policy 76WEGAX9Y65, effective 05/17/25 - 05/17/26
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by "The Hartford" <businesscenter@mail.service.thehartford.com> - 03:12 - 25 Feb 2026 -
Omron Electronics LLC Order Acknowledgement_946583___Turnkey Packaging Solutions LLC
by Orders - 11:52 - 24 Feb 2026 -
Your Amazon.com order of "SYOKO 3 Pack Desoldering..." has shipped!
Hello Lorena Carrillo,
We wanted to let you know that we have shipped your items.
Shipping Confirmation
Expected Delivery
Wednesday, February 25
Shipped to:
Turnpack LLC
22425 S SCOTLAND CT STE 104
QUEEN CREEK,
AZ
85142-1056
United States
PO#
warehouse supplies
Order #
Track your package
SYOKO 3 Pack Desoldering Wick, Braid...
Sold by BANQUNA
Qty: 1
If your operating hours have changed, please update your delivery preferences. Your preferences help us improve your delivery experience.
If you need further assistance with your order, please visit Help & Customer Service.
Unless otherwise noted, items sold by Amazon are subject to sales tax in selected states in accordance with the applicable laws of that state. If your order contains one or more items from a seller other than Amazon, it may be subject to state and local sales tax, depending upon the sellers business policies and the location of their operations. For more information, go to tax and seller information.
This email was sent from a notification-only address that cannot accept incoming email. Do not reply to this message.
by "Amazon.com" <shipment-tracking@amazon.com> - 11:26 - 24 Feb 2026 -
【武蔵ENG】技術コラム「フィールドネットワークとは?」公開のお知らせ
※本メールは過去に弊社Webサイトにログイン登録いただいているお客様に配信しています
Turnpack, LLC
Chris 様お世話になっております。武蔵エンジニアリングです。
このたび、弊社Webサイトの技術コラムページにて、
現場の機器同士をつなぐ産業用ネットワーク、『フィールドネットワーク』の解説記事を掲載いたしました!
このような内容を掲載しています!
◆フィールドネットワーク導入のメリット
◆役割と効果
◆選定方法と弊社の対応規格
ばらばらの規格で困っている、そんな方におすすめの記事です!
導入を検討されている方も、フィールドネットワークについて興味がある方も、ぜひご活用ください。ご不明な点やご相談がございましたら、お気軽にお問い合わせください。
<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<<
武蔵エンジニアリング株式会社
営業本部マーケティング戦略部
〒181-0013 東京都三鷹市下連雀8-7-4
武蔵エンジニアリング|ディスペンサー総合メーカー(液体定量吐出装置) (musashi-engineering.co.jp)
このメールは送信専用アドレスより配信されています。
今後配信をご希望されない場合は、お手数ですがコチラより配信停止設定をお願いいたします。
by "武蔵エンジニアリング株式会社" <online-support@musashi-engineering.co.jp> - 10:47 - 24 Feb 2026 -
FedEx Billing Online - Invoice Ready for Payment


You have a FedEx invoice ready for payment. Pay now. 



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Dear christopher berger, 
Your account ending in 6805 has a new invoice(s) from FedEx ready for payment. 
Invoice number: Invoice amount: 9-191-15673 33.10 9-191-15674 10.96 
Log in to FedEx® Billing Online to review and pay your invoices. 

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by "BillingOnline" <BillingOnline@fedex.com> - 09:37 - 24 Feb 2026 -
RE: Turnpack, LLC Quotation (Ref SO26081024) Benchmark D5L6 quote
Dear Chris
Thank you very much.
Pinij Wannaphuti
Senior Executive Manager, Technical Sales
Semiconductor & Electronics
DKSH Technology Limited (Head Office).2533 Sukhumvit Road, Bangchak,
Phrakhanong, Bangkok 10260, Thailand
Phone +662 639 7000, Mobile +6681 699 5024 / +6681 847 2679
pinij.w@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
____________________________________________________________From: Chris Berger <info@turnpack.com>
Sent: Wednesday, February 25, 2026 8:33 AM
To: Pinij Wannaphuti <pinij.w@dksh.com>
Subject: Turnpack, LLC Quotation (Ref SO26081024) Benchmark D5L6 quoteIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
Hi Pinij, Apologies for the delay. Lorena was out of office and I am travelling this week. Attached is the quote, please let us know if you need anything else. Chris Christopher Berger [...] ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏

SO26081024
$ 38,726.65
Expires on 03/26/2026
Hi Pinij,
Apologies for the delay. Lorena was out of office and I am travelling this week. Attached is the quote, please let us know if you need anything else.
Chris

Christopher BergerPowered by Odoo
by Pinij Wannaphuti - 08:46 - 24 Feb 2026 -
RE: Midas De-Lidder
Dear Christopher, Lorena
Please send me the quote.
Pinij Wannaphuti
Senior Executive Manager, Technical Sales
Semiconductor & Electronics
DKSH Technology Limited (Head Office).2533 Sukhumvit Road, Bangchak,
Phrakhanong, Bangkok 10260, Thailand
Phone +662 639 7000, Mobile +6681 699 5024 / +6681 847 2679
pinij.w@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
____________________________________________________________From: Pinij Wannaphuti
Sent: Monday, February 23, 2026 7:20 PM
To: 'Christopher Berger' <cberger@turnpack.com>; Lorena <info@turnpack.com>
Subject: Midas De-LidderDear Christopher
Benchmark Electronics Thailand wants to buy the De-Lidder to rework of hermetic microelectronic packages. The package information is below. Please send me the technical spec and quotation.
Pinij Wannaphuti
Senior Executive Manager, Technical Sales
Semiconductor & Electronics
DKSH Technology Limited (Head Office).2533 Sukhumvit Road, Bangchak,
Phrakhanong, Bangkok 10260, Thailand
Phone +662 639 7000, Mobile +6681 699 5024 / +6681 847 2679
pinij.w@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
____________________________________________________________
by Pinij Wannaphuti - 08:21 - 24 Feb 2026 -
Re: Turnpack, LLC Order (Ref SO2506843)
Let's keep it open.
Thank youDawn
Dawn Davis
Senior Supply Chain Specialist
t: 480-550-9702
a:
3200 W Germann Road
,
Chandler
Az
85286
From: Lorena <info@turnpack.com>
Sent: Tuesday, February 24, 2026 4:53:29 PM
To: Dawn Davis <Dawn.davis@sarasmicro.com>; 'Turnpack, LLC SO2506843' <catchall@turnpack.com>
Cc: Greg Bitter <greg.bitter@sarasmicro.com>
Subject: RE: Turnpack, LLC Order (Ref SO2506843)Parts have not shipped yet please confirm if you wish to keep open. I will hopefully have a better update on Friday.
Thank you for your time,
Lorena Carrillo
From: Dawn Davis <Dawn.davis@sarasmicro.com>
Sent: Monday, February 23, 2026 4:44 PM
To: Turnpack, LLC SO2506843 <catchall@turnpack.com>
Cc: Greg Bitter <greg.bitter@sarasmicro.com>
Subject: Re: Turnpack, LLC Order (Ref SO2506843)Hi Chris,
I still show this PO open on our end. Were the parts shipped to us or a schedule for the training confirm from Sean?
Thank you,
Dawn
Dawn Davis
Senior Supply Chain Specialist
t: 480-550-9702
a:
3200 W Germann Road
,
Chandler
Az
85286
From: Chris Berger <notifications@turnpack.com>
Sent: Tuesday, March 18, 2025 10:48 AM
To: Dawn Davis <Dawn.davis@sarasmicro.com>
Subject: Turnpack, LLC Order (Ref SO2506843)You don't often get email from notifications@turnpack.com. Learn why this is important
Hello, Your order SO2506843 amounting in $ 13,121.99 has been confirmed. Thank you for your trust! Do not hesitate to contact us if you have any questions. Christopher Berger Phone: +1 [...] ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏

SO2506843
$ 13,121.99
Hello,
Your order SO2506843 amounting in $ 13,121.99 has been confirmed.
Thank you for your trust!
Do not hesitate to contact us if you have any questions.
Christopher BergerPowered by Odoo
by Dawn Davis - 07:57 - 24 Feb 2026 -
Shipped on Order PO26081607: Drill Bits, Socket Head Screws, and Taps
We shipped the drill bits, socket head screws, and taps on order PO26081607. You will receive them tomorrow. Track your shipment using FedEx 512608317248.
by "McMaster-Carr" <la.sales@mcmaster.com> - 07:57 - 24 Feb 2026 -
Confirmation of your order PO26081609 from Mouser Electronics, Inc.
Mouser Electronics, Inc. - Order Confirmation

Order Confirmation Purchase Order Number : PO26081609 Web Order Number : 38375908 Contact Name : CHRISTOPHER BERGER Order Date : FEB 24, 2026 Customer Number : 612B535
Christopher Berger,
Thank you for your order.
As soon as your order is shipped, you will receive a Shipment Notification email.
Meanwhile, use the link below to view the real-time status of your order.
ORDER STATUS Web Order Number 38375908 Order Date FEB 24, 2026
Please rate your experience with Mouser
Ordered - Processing - Warehouse - Picked - Preparing Shipment - Shipped
A summary of your order is included below.
Thank you for your business.
Customer Service
Customer Service Representative Shipping Method Terms Internet Customer Service UPS 2nd Day Air Net 30 Bill To TURNPACK
Attn: CHRIS BERGER
22425 S SCOTLAND CT
104
QUEEN CREEK, ARIZONA 85142
UNITED STATES
Ship To TURNPACK
Attn: CHRIS BERGER
22425 S SCOTLAND CT
STE 104
QUEEN CREEK, ARIZONA 85142
UNITED STATES
Line Number Mouser Part Number
Customer Part Number
Manufacturer Part Number
Description
Requested
Delivery
Date(s)Estimated
Shipment
Date(s)Quantity Unit Price
(USD)Extended Price
(USD)
1
560-386
1
D4ELCP07
386
Std Midget Groove 14
FEB 24, 2026
FEB 24, 2026
20
0.894 17.88
2
575-1968001150000030
2
1968-0-01-15-00-00-03-0
Spring-Loaded Target
FEB 24, 2026
FEB 24, 2026
50
1.330 66.50
1
RoHS: Compliant through Exemption
2
RoHS: Compliant
Shipping Notes Merchandise Total
(USD)$84.38 Shipping $13.99 Estimated Tax $0.00
This order is subject to all terms and conditions displayed at:
https://www.mouser.com/saleterms
by "Mouser Order Update" <orders@mouser.com> - 07:57 - 24 Feb 2026 -
Your Amazon.com order of "SYOKO 3 Pack Desoldering...".
Hello Lorena Carrillo,
Thank you for shopping with us. We’ll send a confirmation once your item has shipped. Your order details are indicated below. The payment details of your transaction can be found on the order invoice. If you would like to view the status of your order or make any changes to it, please visit Your Orders on Amazon.com.
This order is placed on behalf of Turnpack.
Order Confirmation
Your guaranteed delivery date is:
tomorrow, February 25
Your order will be sent to:
Turnpack LLC
QUEEN CREEK, AZUnited States
Your shipping speed:
FREE Prime Delivery PO#
warehouse supplies
Order #
View or manage order
SYOKO 3 Pack Desoldering Wick, Braid...
Tools & Home Improvement
Sold by BANQUNA
Condition: New
Qty : 1
$8.54
Order Total:
$8.54
To learn more about ordering, go to Ordering from Amazon.com.
If you want more information or need more assistance, go to Help.
The payment for your invoice is processed by Amazon Payments, Inc. P.O. Box 81226 Seattle, Washington 98108-1226. If you need more information, please contact (866) 216-1075
By placing your order, you agree to Amazon.com’s Privacy Notice and Conditions of Use. Unless otherwise noted, items sold by Amazon.com are subject to sales tax in select states in accordance with the applicable laws of that state. If your order contains one or more items from a seller other than Amazon.com, it may be subject to state and local sales tax, depending upon the seller's business policies and the location of their operations. Learn more about tax and seller information.
This email was sent from a notification-only address that cannot accept incoming email. Please do not reply to this message.
by "Amazon.com" <auto-confirm@amazon.com> - 07:57 - 24 Feb 2026 -
Mouser Electronics Order Confirmation
View Online
The Newest Products for Your Newest Designs® Your Order Has Been ReceivedDear Christopher Berger,
Thank you for placing your order with Mouser Electronics. Once your order has been released for processing, you will receive additional emails with your Mouser Sales Order number and delivery information. To view the status of your order, simply log in to your My Mouser account or click on the order status link below:Your Order Information
Web Order #: 38375908
Order Date: 2/24/2026
You may also use the following link to view your order status:
https://www.mouser.com/account/orders/detail?qs=9C%2fvjDbyW3XbZVweW%2fGf%2fwkw1baVSvvokqKigWWO3d4%3dThank you,Mouser Electronicsmouser.com Feedback | Privacy Policy | Terms and Conditions | Help
To ensure delivery to your inbox,
please add orders@t.mouser.com to your address book.
© 2026 Mouser and Mouser Electronics. All rights reserved.
Mouser Electronics Inc. - 1000 North Main Street, Mansfield, TX 76063, USA
by "Mouser Electronics" <orders@t.mouser.com> - 07:56 - 24 Feb 2026 -
Re: EXT :Re: Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Sounds good. I'll see you in the morning.Christopher BergerOn Tue, Feb 24, 2026, 4:51 PM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:Hi Chris –
We’d still like for you to come out, please. If nothing else, we’d appreciate your expertise to give our machine a good ‘once over’ and share knowledge with us.
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 24, 2026 4:49 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportOk great. I have travel booked but if you want to cancel that works too, I'd still have to invoice for non refundable travel though. Let me know in the next 15min.
Chris
Christopher Berger
On Tue, Feb 24, 2026, 4:47 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Chris,
From your text, this worked: “When you log in as super user you should see a button for Mini BMC Cavity Position”
Auto-calibration is complete. I need to adjust Theta zero position to match the tools’ locating pins. Then a full system backup and we will see if we have issues with production.
Dave
Get Outlook for iOS
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Tuesday, February 24, 2026 3:31:00 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: Re: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
Great. Please text me at 8588609985 when you get here.
I have the correct TD Tool and used it for the auto-calibration. Trying a Z height change. The other tool was longer so logically the correct tool will stop short.
Dave
Get Outlook for iOS
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 24, 2026 3:16:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David, Mike,
I'll be there tomorrow between 8:00-8:30am.
Regarding the TD tool, I thought you located the correct one? If you didn't find it, please let me know; otherwise, I'll have to figure something out.
Chris
On Tue, Feb 24, 2026 at 4:11 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Chris,
Thanks for sending those messages. I am back in the office today.
I think the TD pickup Z position for the chip is off because we were using a non-standard TD tool. The machine is programmed for the longer TD tool.
I am headed out to change this Z value slightly to see if it will change the Z position. If it does my plan is to reduce the Z height until it touches and picks up the chip.
Please let me know your ETA tomorrow. As Mike said, just bring an ID. I must escort you while you are here, but we will be in a regular production area.
Thank you,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDave,
I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.
If you can't get it up and running I can probably be onsite next Wednesday.
Chris
On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
Get Outlook for iOS
From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
Get Outlook for iOS
From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
by Chris Berger - 07:52 - 24 Feb 2026 -
RE: Abbott :: Turnpack :: PO#8119038263 :: Nozzle
Thanks, Lorena.
*** Wishing you a Year of the Horse filled with freedom, joy, and prosperity ***
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Lorena <info@turnpack.com>
Sent: Wednesday, 25 February, 2026 8:01 AM
To: Garrot Choy <garrot.choy@dksh.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>; Technology SCE Logistics SG <tec.sce.logistics.sg@dksh.com>
Subject: RE: Abbott :: Turnpack :: PO#8119038263 :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
Scheduled to arrive Friday Fedex: 888945101098
Thank you for your time,
Lorena Carrillo
From: Garrot Choy <garrot.choy@dksh.com>
Sent: Monday, February 23, 2026 11:35 PM
To: Lorena <info@turnpack.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>; Technology SCE Logistics SG <tec.sce.logistics.sg@dksh.com>
Subject: RE: Abbott :: Turnpack :: PO#8119038263 :: NozzleHi, Lorena
Is there any updated for this PO?
*** Wishing you a Year of the Horse filled with freedom, joy, and prosperity ***
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Lorena <info@turnpack.com>
Sent: Wednesday, 11 February, 2026 11:52 AM
To: Garrot Choy <garrot.choy@dksh.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>; Technology SCE Logistics SG <tec.sce.logistics.sg@dksh.com>
Subject: RE: Abbott :: Turnpack :: PO#8119038263 :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
We are expecting to ship by Friday.
Thank you for your time,
Lorena Carrillo
From: Garrot Choy <garrot.choy@dksh.com>
Sent: Sunday, February 8, 2026 10:29 PM
To: Lorena <info@turnpack.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>; Technology SCE Logistics SG <tec.sce.logistics.sg@dksh.com>
Subject: RE: Abbott :: Turnpack :: PO#8119038263 :: NozzleHi, Lorena
Any updated for the ETD?
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Lorena <info@turnpack.com>
Sent: Saturday, 24 January, 2026 7:24 AM
To: Garrot Choy <garrot.choy@dksh.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>; Technology SCE Logistics SG <tec.sce.logistics.sg@dksh.com>
Subject: RE: Abbott :: Turnpack :: PO#8119038263 :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
Received will send confirmation shortly once production approves.
Thank you for your time,
Lorena Carrillo
From: Garrot Choy <garrot.choy@dksh.com>
Sent: Thursday, January 22, 2026 9:17 PM
To: Lorena <info@turnpack.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>; Technology SCE Logistics SG <tec.sce.logistics.sg@dksh.com>
Subject: Abbott :: Turnpack :: PO#8119038263 :: NozzleHi, Lorena
Hereby attached a new PO for your process.
Please acknowledge and provide Order Confirmation/Ship Date within 3 working days.
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Lorena <info@turnpack.com>
Sent: Friday, 23 January, 2026 6:22 AM
To: Garrot Choy <garrot.choy@dksh.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: RE: Abbott :: Midas :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
Yes pricing includes a discount.
Thank you for your time,
Lorena Carrillo
From: Garrot Choy <garrot.choy@dksh.com>
Sent: Wednesday, January 21, 2026 6:24 PM
To: Info at Turnpack <info@turnpack.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: RE: Abbott :: Midas :: NozzleHi, Lorena
May I know do we still entitle 10% discount for distributor price?
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Info at Turnpack <info@turnpack.com>
Sent: Wednesday, 14 January, 2026 9:35 AM
To: Garrot Choy <garrot.choy@dksh.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: Re: Abbott :: Midas :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
It is an email. If you do not see it please check your spam.
Respectfully,
Lorena CarrilloOn Tue, Jan 13, 2026, 6:25 PM Garrot Choy <garrot.choy@dksh.com> wrote:
Hi, Lorena
Noted for your information.
By the way, can you please email us the quotation?
We do not have access to your system.
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Lorena <info@turnpack.com>
Sent: Wednesday, 14 January, 2026 9:21 AM
To: Garrot Choy <garrot.choy@dksh.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: RE: Abbott :: Midas :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
Revision sent!
Please note Ken and Armeniah retired a few years ago. No need to copy them.
Thank you for your time,
Lorena Carrillo
From: Garrot Choy <garrot.choy@dksh.com>
Sent: Tuesday, January 13, 2026 5:16 PM
To: Lorena <info@turnpack.com>; 'astepanian' <astepanian@midastechnology.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; 'kentowl' <kentowl@midastechnology.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: RE: Abbott :: Midas :: NozzleDear Lorena
Please quote total 2 items as below :
H4JANA06P
Angled Nozzle w probe .060Qty: 5 pcs
H5JAJT15
Coiled Tungsten heaterQty: 2 pcs
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
From: Lorena <info@turnpack.com>
Sent: Wednesday, 14 January, 2026 2:08 AM
To: Garrot Choy <garrot.choy@dksh.com>; 'astepanian' <astepanian@midastechnology.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; 'kentowl' <kentowl@midastechnology.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: RE: Abbott :: Midas :: NozzleIf you do not recognize the sender or if you find the email suspicious, report it as a phishing email using the Outlook function and a NOVA ticket will be generated.
Hi Garrot, your quote has been sent via our system, and I have attached here for your reference. If you have any questions, please let me know.
Please note a min order quantity of 5 applies and there is an additional $25 added due to the last invoice being short paid by $25. This may be due to a banking fee on your end. Please note, Turnpack LLC is not liable for any vendor banking fees.
For details on invoice INV/2024/09/0003, $3,774.92 was received on January 2nd 2025, while the invoice total is $3,799.92, leaving a short payment of $25.
Lorena Carrillo
Office Manager
Office: 480-331-1878
Line: 781-938-006922425 S Scotland Ct, Suite104, Queen Creek, AZ 85142
lcarrillo@turnpack.com | www.turnpack.com
https://www.turnpack.com/midas-rework/delidderFrom: Garrot Choy <garrot.choy@dksh.com>
Sent: Tuesday, January 13, 2026 2:04 AM
To: astepanian <astepanian@midastechnology.com>
Cc: Flora Fung <flora.fung@dksh.com>; Chai Peng Fong <chai.peng.fong@dksh.com>; Cin Lin Soon <cin.lin.soon@dksh.com>; kentowl <kentowl@midastechnology.com>; Chin Hwa Chua <joshua.chua@dksh.com>
Subject: Abbott :: Midas :: NozzleDear Armineh
Good day.
Please quote for below with lead time as well.
H4JANA06P
Angled Nozzle w probe .060Qty: 4 pcs
Thank you for your time and support.
* Stay Positive * Stay Healthy * Stay safe *
Best regards,
Garrot
____________________________________________________________
DKSH
Garrot Choy
Executive, Order Processing Client & Customer Service
Semiconductor and Technology
DKSH Technology Sdn. Bhd. (47709-T)
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang, Malaysia
Phone +60 4 645 2672, Mobile +60 16 428 3318
garrot.choy@dksh.com, www.dksh.com
Delivering Growth – in Asia and Beyond.
__________________________________________________________
The information of this email is strictly confidential and may be legally privileged. It is intended solely for the addressee. If you received this in error, please contact the sender and delete the material from any computer. Any review, retransmission, dissemination or other use of this information by persons or entities other than the intended recipient is prohibited.
by Garrot Choy - 07:21 - 24 Feb 2026 -
Confirmation for Your Order PO26081607
Thank you for your order. We will deliver your items tomorrow between 3 and 5 pm.Confirmation
Delivery address
Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142
Attention: Suite 104Billing address
Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142Delivery method
StandardOrder date
2/24/2026Payment method
InvoicePlaced by
Christopher BergerMcMaster-Carr number
3263819PO26081607 Delivers Feb 25, 3-5 pm 1 High-Speed Steel Chip-Clearing Tap for Blind Holes
Uncoated, Plug Chamfer, M5 x 0.8 mm Thread Size
26355A432
each14.51
each$29.02 2 Quick-Change Uncoated Carbide Drill Bit
0.70 mm Size
2841A122
each7.27
each$14.54 3 18-8 Stainless Steel Low-Profile Socket Head Screws
with Hex Drive, M6 x 1 mm Thread, 40 mm Long
92855A6312
packs of 106.49
pack$12.98 Merchandise 56.54 Shipping 11.76 Total $68.30 Your order is subject only to our terms and conditions, available at www.mcmaster.com or from our Sales Department. Phone: (562) 692-5911 Email: la.sales@mcmaster.com
by "McMaster-Carr" <la.sales@mcmaster.com> - 07:07 - 24 Feb 2026 -
Automatic reply: Abbott :: Turnpack :: PO#8119038263 :: Nozzle
Dear Sender,Thank you for your email.
I'm currently out of the office.
I’ll get back to you as soon as possible upon my return.
Best regards,
CL
by "Cin Lin Soon" <cin.lin.soon@dksh.com> - 07:01 - 24 Feb 2026 -
Re: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Hi Chris,
Great. Please text me at 8588609985 when you get here.
I have the correct TD Tool and used it for the auto-calibration. Trying a Z height change. The other tool was longer so logically the correct tool will stop short.
Dave
Get Outlook for iOS
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 24, 2026 3:16:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David, Mike,
I'll be there tomorrow between 8:00-8:30am.
Regarding the TD tool, I thought you located the correct one? If you didn't find it, please let me know; otherwise, I'll have to figure something out.
Chris
On Tue, Feb 24, 2026 at 4:11 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Chris,
Thanks for sending those messages. I am back in the office today.
I think the TD pickup Z position for the chip is off because we were using a non-standard TD tool. The machine is programmed for the longer TD tool.
I am headed out to change this Z value slightly to see if it will change the Z position. If it does my plan is to reduce the Z height until it touches and picks up the chip.
Please let me know your ETA tomorrow. As Mike said, just bring an ID. I must escort you while you are here, but we will be in a regular production area.
Thank you,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDave,
I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.
If you can't get it up and running I can probably be onsite next Wednesday.
Chris
On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
Get Outlook for iOS
From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
Get Outlook for iOS
From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
15120 Innovation Dr
San Diego, CA 92128
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
by David Kellog - 06:31 - 24 Feb 2026 -
Re: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Hi David, Mike,I'll be there tomorrow between 8:00-8:30am.Regarding the TD tool, I thought you located the correct one? If you didn't find it, please let me know; otherwise, I'll have to figure something out.ChrisOn Tue, Feb 24, 2026 at 4:11 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:Chris,
Thanks for sending those messages. I am back in the office today.
I think the TD pickup Z position for the chip is off because we were using a non-standard TD tool. The machine is programmed for the longer TD tool.
I am headed out to change this Z value slightly to see if it will change the Z position. If it does my plan is to reduce the Z height until it touches and picks up the chip.
Please let me know your ETA tomorrow. As Mike said, just bring an ID. I must escort you while you are here, but we will be in a regular production area.
Thank you,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDave,
I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.
If you can't get it up and running I can probably be onsite next Wednesday.
Chris
On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
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From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
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From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
15120 Innovation Dr
San Diego, CA 92128
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
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Christopher Berger
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Christopher Berger
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Christopher Berger
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Christopher Berger
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--Christopher Berger
by Chris Berger - 06:17 - 24 Feb 2026


