Datacon and Besi service, SECS/GEM-native
work cells, and precision die bonding automation.
Deep expertise in die bonding, advanced packaging, and factory integration. Service and tooling for aging equipment. Custom automation for new processes.
Talk to an EngineerPain Points We Solve
Aging Datacon/Besi Equipment
Limited OEM support for legacy die bonders. We service, calibrate, and build tooling for these systems with 20+ years of hands-on experience.
SECS/GEM Required
Your fab requires factory host integration. Every FactoryRobot ships with E5/E30/E37/E10 SECS/GEM connectivity built in.
Advanced Packaging
Chiplet assembly, precision die bonding, and 2.5D/3D packaging creating demand for custom automation that doesn't exist off the shelf.
Products for Semiconductor
Datacon EVO Service & Tooling
Field service, calibration, bondhead replacement, custom tooling, refurbished systems. US-based, faster than the OEM.
EVO Support →Custom Die Bonding & P&P
SECS/GEM-native work cells with HALCON vision, ±15µm placement, and full process data logging. Built for fab environments.
Learn more →Semiconductor customers