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Invoice for Your Order PO26071601
InvoiceBilled toTURNPACK LLC
22425 S SCOTLAND CT STE 104
QUEEN CREEK AZ 85142Purchase Order PO26071601 Total $961.23 Invoice 60093559 Invoice Date 2/18/26 Payment Terms 2% 10, Net 30 Deduct $18.75 on merchandise if paid by 2/28/26. Shipped toAttention: Suite 104Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142Mail Payment to McMaster-Carr
PO Box 7690
Chicago IL 60680-7690Your Account 438808000 Christopher Berger placed this order.Line Product Ordered Shipped Balance Price Total 1 7673K63 Continuous-Flex Cable 600V AC, Four 16-Gauge Wires, 50 ft. Length 1 Each1 0 163.50 Each163.50 2 7673K57 Continuous-Flex Cable 600V AC, Four 18-Gauge Wires, 50 ft. Length 1 Each1 0 122.50 Each122.50 3 5337N21 Continuous-Flex Cable, 300V AC, Four 22-Gauge Wires, 50 Feet Long 1 Each1 0 123.70 Each123.70 4 4514N11 Continuous-Flex Cable, 600V AC, Fifteen 22 Gauge Wires, 20 Feet Long 1 Each1 0 90.20 Each90.20 5 8841T41 Quick-Connect Terminal Block, 5 Circuits, Black 10 Each10 0 4.83 Each48.30 6 8128T1 Industrial Communication-Standard Cable Flexible, MODBUS, 0.23" OD, 10 ft. Length 1 Each1 0 38.30 Each38.30 7 7734T4 Category 5E Shielded Ethernet Cord, RJ45 x RJ45, 10 Feet Long, Black 10 Each10 0 28.72 Each287.20 8 5225K566 Push-to-Connect Tube Fitting for Air, 90 Degree Swivel Elbow, for 6mm Tube OD, M5 x 0.8mm Male 10 Each10 0 6.40 Each64.00 Merchandise 937.70 Shipping 23.53 Total $961.23 Packing List Shipped Weight Carrier Tracking 2977181-01 02/18/2026 15 lb FedEx 512608136752 Federal ID 36-1458720
por "McMaster-Carr" <invoice.reply@mcmaster.com> - 02:56 - 19 feb. 2026 -
SAP Business Network - Degradation: Issue Resolved (EVC1940031)
SAP Communication
Issue Resolved
You can access the system again.
Dear SAP Business Network Supplier,The Degradation reported previously has been resolved.Impact Prior to Resolution:A subset of our SAP Business Network suppliers may experience transactions such as Order Confirmations and Invoices temporarily stuck in Queued status.Solution:SAP Technical Teams identified and removed a transaction that was responsible for the slowness in processing of transactions as experienced by a subset of our SAP Business Network suppliers, fully restoring system functionality.We are sorry for any inconvenience this may have caused. Thank you for your patience.Start Time: February 18, 2026 at 8:15:00 PM UTC
End Time: February 18, 2026 at 9:14:00 PM UTCProduct Name Affected Entity SAP Business Network SAP Business Network for Suppliers Questions
Please contact SAP Support by visiting Help Center.
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Your SAP Team
SAP SE | Dietmar-Hopp-Allee 16 | 69190 Walldorf | Germany
www.sap.comThis e-mail may contain trade secrets or privileged, undisclosed, or otherwise confidential information. If you have received this e-mail in error, you are hereby notified that any review, copying, or distribution of it is strictly prohibited. Please inform us immediately and destroy the original transmittal. Thank you for your cooperation.
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por "SAP CloudSupport Alerts" <sapcloudsupport@alerts.ondemand.com> - 08:41 - 18 feb. 2026 -
SAP Business Network - Degradation: Issue Identified (EVC1990066)
SAP Communication
Issue Identified
We apologize for impacting your business and appreciate your patience while we work to resolve it.
Dear SAP Business Network Supplier,We have identified a Degradation affecting your below entities.Impact:A subset of our SAP Business Network suppliers may experience transactions such as Order Confirmations and Invoices temporarily stuck in Queued status.The response team continues to investigate this issue at the highest priority.Start Time: February 18, 2026 at 8:15:00 PM UTC
Product Name Affected Entity SAP Business Network SAP Business Network for Suppliers Questions
Please contact SAP Support by visiting Help Center.
Let's Run Better Together!
Your SAP Team
SAP SE | Dietmar-Hopp-Allee 16 | 69190 Walldorf | Germany
www.sap.comThis e-mail may contain trade secrets or privileged, undisclosed, or otherwise confidential information. If you have received this e-mail in error, you are hereby notified that any review, copying, or distribution of it is strictly prohibited. Please inform us immediately and destroy the original transmittal. Thank you for your cooperation.
You have received this notification because your email address, or a group email address that you belong to, is configured in an account on the SAP Business Network. To make changes, please update the Network Service Subscription by selecting settings and notifications within your profile to the top right. If you do not have access to your organization's account, please request assistance from your SAP Business Network Account Administrator or submit a request for assistance via Help Center.
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por "SAP CloudSupport Alerts" <sapcloudsupport@alerts.ondemand.com> - 07:31 - 18 feb. 2026 -
Confirmation for Your Order PO26071601
Thank you for your order. We will deliver your items tomorrow between 3 and 5 pm.Confirmation
Delivery address
Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142
Attention: Suite 104Billing address
Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142Delivery method
StandardOrder date
2/18/2026Payment method
InvoicePlaced by
Christopher BergerMcMaster-Carr number
2977181PO26071601 Delivers Feb 19, 3-5 pm 1 Continuous-Flex Cable
600V AC, Four 16-Gauge Wires, 50 ft. Length
7673K631
each163.50
each$163.50 2 Continuous-Flex Cable
600V AC, Four 18-Gauge Wires, 50 ft. Length
7673K571
each122.50
each$122.50 3 Continuous-Flex Cable
300V AC, Four 22-Gauge Wires, 50 Feet Long
5337N211
each123.70
each$123.70 4 Continuous-Flex Cable
600V AC, Fifteen 22 Gauge Wires, 20 Feet Long
4514N111
each90.20
each$90.20 5 Quick-Connect Terminal Block
5 Circuits, Black
8841T4110
each4.83
each$48.30 6 Industrial Communication-Standard Cable
Flexible, MODBUS, 0.23" OD, 10 ft. Length
8128T11
each38.30
each$38.30 7 Category 5E Shielded Ethernet Cord
RJ45 x RJ45, 10 Feet Long, Black
7734T410
each28.72
each$287.20 8 Push-to-Connect Tube Fitting for Air
90 Degree Swivel Elbow, for 6mm Tube OD, M5 x 0.8mm Male
5225K56610
each6.40
each$64.00 Merchandise 937.70 Shipping 23.53 Total $961.23 Your order is subject only to our terms and conditions, available at www.mcmaster.com or from our Sales Department. Phone: (562) 692-5911 Email: la.sales@mcmaster.com
por "McMaster-Carr" <la.sales@mcmaster.com> - 07:16 - 18 feb. 2026 -
RE: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Hi Chris –
Address:
15120 Innovation Drive
San Diego, CA 92128
The machine is not in a lab that requires additional ID or access, so all you will need is a valid government ID (driver’s license, passport, etc) to be issued a Visitor badge by our Security team when you arrive. You’ll be escorted for the entirety of the trip.
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:40 PM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
One more thing before I send the quote. Can you send me your address and let me know if there are special ID or access requirements?
Chris
On Wed, Feb 18, 2026 at 3:30 PM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Thanks, Chris! Yes, if we would plan on you being onsite next Wed, that would be fantastic! Even if we get the machine running before then (Dave is back next Tues), it would be good peace of mind to have your expertise give the machine a good check-up.
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDave,
I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.
If you can't get it up and running I can probably be onsite next Wednesday.
Chris
On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
Get Outlook for iOS
From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
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From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
15120 Innovation Dr
San Diego, CA 92128
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
por michael.a.white@ngc.com - 06:21 - 18 feb. 2026 -
Re: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Mike,One more thing before I send the quote. Can you send me your address and let me know if there are special ID or access requirements?ChrisOn Wed, Feb 18, 2026 at 3:30 PM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:Thanks, Chris! Yes, if we would plan on you being onsite next Wed, that would be fantastic! Even if we get the machine running before then (Dave is back next Tues), it would be good peace of mind to have your expertise give the machine a good check-up.
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDave,
I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.
If you can't get it up and running I can probably be onsite next Wednesday.
Chris
On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
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From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
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From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
15120 Innovation Dr
San Diego, CA 92128
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--Christopher Berger
por Chris Berger - 05:41 - 18 feb. 2026 -
RE: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Thanks, Chris! Yes, if we would plan on you being onsite next Wed, that would be fantastic! Even if we get the machine running before then (Dave is back next Tues), it would be good peace of mind to have your expertise give the machine a good check-up.
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDave,
I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.
If you can't get it up and running I can probably be onsite next Wednesday.
Chris
On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
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From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
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From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
15120 Innovation Dr
San Diego, CA 92128
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
por michael.a.white@ngc.com - 05:31 - 18 feb. 2026 -
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Re: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support
Dave,I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.If you can't get it up and running I can probably be onsite next Wednesday.ChrisOn Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:Hi Chris,
The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.
I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not.
Thank you,
Dave
Get Outlook for iOS
From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris –
Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.
We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?
Many thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportMike,
No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.
Chris
On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
Hi Chris –
Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.
The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?
Sorry for the armchair QBing.
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid,
Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.
Did you inspect the BMC tool surface?
Chris
On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.
Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.
Thank you,
Dave
Get Outlook for iOS
From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHI Mike,
To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).
Hope this helps. You guys did great work on your own, you are almost there.
Chris
On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:
All –
As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?
Thanks!
Mike
MICHAEL WHITE | San Diego Manufacturing Engineering Manager
Northrop Grumman Corporation | Mission Systems
O: 858-592-3865 | C: 858-472-1768 | michael.a.white@ngc.com
From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHello Chris,
Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!
You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.
Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.
There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportDavid/Mike,
Sorry took me a bit longer to get the picture. Hope this helps
Chris
On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.
Best regards,
Dave
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.
Chris
On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Hi Chris,
Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.
This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.
We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.
Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?
Our location is:
15120 Innovation Dr
San Diego, CA 92128
Thank you,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine SupportThanks for the update, Dave.
Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.
Christopher Berger
On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:
Hi Chris,
It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.
Best regards,
Dave
From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi Chris,
For our call I have added info to the log file timeline below.
Thank you,
Dave
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine SupportHi David,
Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?
Time
Event
~Jan 11
Warning precedes the alarm (customer report)
Jan 13 09:51
First theta homing failure — tracking error + current limit
Jan 13 11:16
Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20
Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20
Alarm state persists for ~1 week
~Jan 20
Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward
Theta homed but ~4° off center
Jan 29 12:23
Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43
Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11
Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06
Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25
Bond force calibration fails
Jan 29 15:27-15:45
Continued tool detection failures during production attempts
Chris
On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:
Thank you, Jim!
Hi Chris,
Thank you offering to help with our machine woes. This has been an evolving issue since January 13th.
System info:
MC4 Datacon 2200 evo Automatic Dispense and Component Placement System
SN: 9502610007253
Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.
Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.
Symptoms:
1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.
This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.
After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.
Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.
Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.
Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.
Best regards,
Dave Kellogg | Process Engineer
Northrop Grumman | Mission Systems
C: 858-860-9985 | david.kellogg@ngc.com
From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine SupportHi Jim,
Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:
- Machine Serial number and configuration (images would be helpful so I know what you in the machine)
- Description of the problem
- Screenshot of the errors
- Logfile
Thanks,
Chris
Christopher Berger
On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:
Hi Christopher,
Thanks for your willingness to support our Besi machine that is currently non-operational. I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.
Dave, please provide a quick summary of the current situation.
--Jim
JIM WERLAND | Director, NIC San Diego Manufacturing Engineering
Northrop Grumman Corporation | Mission Systems
O: 858-592-3288 | C: 858-735-1286 | jim.werland@ngc.com
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--
Christopher Berger
--Christopher Berger
por Chris Berger - 05:21 - 18 feb. 2026 -
Order #14598 confirmed
Thank you for your purchase!
Order #14598 Thank you for your purchase!
Hi Christopher, we're getting your order ready to be shipped. We will notify you when it has been sent. We greatly appreciate your patience!
View your order or Visit our store Order summary
Alpha Solder Preforms 0603 SAC305 Lead-Free, Tape & Reel, 4000 pc Reel × 1
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Shipping address
Christopher Berger
Turnpack, LLC
22425 S Scotland Ct
Suite 104
Queen Creek AZ 85142
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Christopher Berger
Turnpack, LLC
22425 S Scotland Ct
Suite 104
Queen Creek AZ 85142
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por "Intuit QuickBooks" <intuit@eq.intuit.com> - 02:37 - 18 feb. 2026 -
Action needed: Provide additional registration information to NGC Supply Chain
NGC Supply Chain Hello Chris Berger,
Supplier Name: TURNKEY PACKAGING SOLUTIONS LLC
Supplier Address: 22425 S Scotland Ct, Queen Creek, US-AZ
NGC Supply Chain reviewed your registration and needs additional information before approval. Please provide the information described in the following comments.
Comments:
4.3 Second Request - The W-9 submitted in Question 4.3 does not have a valid signature (signature appears to be digital but without a time stamp). Please submit a W-9 with an original "wet" ink signature or a digital adobe certificate signature with a timestamp (4.7 is indicating Adobe-type format). Copy-pasted, typed, and digitally drawn signatures will not be accepted. DocuSign signatures will not be accepted without a certificate of completion from DocuSign.
To provide this information, go to the registration questionnaire and update your answers.
Click Here
Sincerely,
NGC Supply ChainYou are receiving this email because your customer, NGC Supply Chain, has identified you as the appropriate contact for this correspondence. If you are not the correct contact, please contact NGC Supply Chain. Offices | Data Policy | Contact Us | Customer Support Powered by 
por "Ariba Administrator" <no-reply@ansmtp.ariba.com> - 02:17 - 18 feb. 2026 -
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por "CDTFA" <noreply@cdtfa.ca.gov> - 01:56 - 18 feb. 2026 -
RE: EXT :RE: RE: RE: Northrop Grumman Supplier Set-up
Thanks!
PAIGE SHERVANICK | Supply Chain Procurement Specialist
Northrop Grumman | Mission Systems
Phone: 703-561-5627 | paige.shervanick@ngc.com
From: Lorena <info@turnpack.com>
Sent: Wednesday, February 18, 2026 1:42 PM
To: Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>
Subject: EXT :RE: RE: RE: Northrop Grumman Supplier Set-upRevision just submitted.
Thank you for your time,
Lorena Carrillo
From: Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com>
Sent: Wednesday, February 18, 2026 11:31 AM
To: Lorena <info@turnpack.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>
Subject: RE: EXT :RE: RE: Northrop Grumman Supplier Set-upHi Lorena,
Thanks for completing the questionnaire so quickly! I don’t know if you’ve seen it yet, but the questionnaire was sent back to you with the following comments for correction:
Question 4.3 The W-9 submitted in Question 4.3 does not have a valid signature. Please submit a W-9 with an original "wet" ink signature or a digital adobe certificate signature with a timestamp. Copy-pasted, typed, and digitally drawn signatures will not be accepted. DocuSign signatures will not be accepted without a certificate of completion from DocuSign.
Question 6.1 Account holder name is a required field as it will integrate into the supplier's vendor master database. Account holder name should reflect supplier legal name submitted in 3.2. Also, please include Bank Control Key.
Question 6.4 Vendor’s Bank Contact information (Name in 6.4.1, Title in 6.4.2 and telephone number in 6.4.3) are required fields by the Treasury Dept and will integrate into the supplier's vendor master database. We can accept Customer Service for Contact Name and Title and general phone number for the bank.
Please let me know if you have any questions/let me know when you’ve submitted again with these corrections. Thanks!
PAIGE SHERVANICK | Supply Chain Procurement Specialist
Northrop Grumman | Mission Systems
Phone: 703-561-5627 | paige.shervanick@ngc.com
From: Shervanick, Paige [US] (MS)
Sent: Tuesday, February 17, 2026 5:12 PM
To: 'Lorena' <info@turnpack.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>
Subject: RE: EXT :RE: RE: Northrop Grumman Supplier Set-upHi Lorena,
You should have just received your invitation to the Ariba questionnaire. Please let me know if you got it and can access the form online.
Thanks!
PaigePAIGE SHERVANICK | Supply Chain Procurement Specialist
Northrop Grumman | Mission Systems
Phone: 703-561-5627 | paige.shervanick@ngc.com
From: Lorena <info@turnpack.com>
Sent: Tuesday, February 17, 2026 1:45 PM
To: Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>
Subject: EXT :RE: RE: Northrop Grumman Supplier Set-upYes and yes thanks!
Thank you for your time,
Lorena Carrillo
From: Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com>
Sent: Tuesday, February 17, 2026 11:43 AM
To: Lorena <info@turnpack.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>
Subject: RE: EXT :RE: Northrop Grumman Supplier Set-upThanks for the info, Lorena!
Just confirming, I should send the questionnaire to you, Lorena Carrillo, at the address- info@turnpack.com?
And could you confirm whether the attached screenshot would be accurate for your company?
Thanks,
Paige
PAIGE SHERVANICK | Supply Chain Procurement Specialist
Northrop Grumman | Mission Systems
Phone: 703-561-5627 | paige.shervanick@ngc.com
From: Lorena <info@turnpack.com>
Sent: Tuesday, February 17, 2026 1:05 PM
To: Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>
Subject: EXT :RE: Northrop Grumman Supplier Set-upHi Paige,
Here is our information.
Entity Name
TURNKEY PACKAGING SOLUTIONS LLC
Entity Type
Domestic LLC
Incorporation Date
7/31/2013
SoS
L18639728
DBA
Turnpack LLC
Address
22425 S Scotland Ct Suite 104 Queen Creek AZ 85142
Phone
480-331-1878
EIN
46-3274315
DNB
12-109-3661
Thank you for your time,
Lorena Carrillo
From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 13, 2026 7:56 AM
To: Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com>
Cc: Keplinger, Sarah N [US] (MS) <Sarah.Keplinger@ngc.com>; Lorena Carrillo <lcarrillo@turnpack.com>
Subject: Re: Northrop Grumman Supplier Set-upHi Paige,
Thanks for reaching out. I have cc'd Lorena on this email and she'll be able to assist with this process.
Thanks
Chris
On Fri, Feb 13, 2026 at 7:20 AM Shervanick, Paige [US] (MS) <Paige.Shervanick@ngc.com> wrote:
Hi,
We are hoping to get Turnpack set up as a supplier with Northrop Grumman. To start this, we will need to send you our Supplier Registration Questionnaire. It includes questions about banking, taxes, compliance, capabilities, etc… and is housed on a site called Ariba. I have to send it to one POC to start, but then that person can invite others at your company to the questionnaire for help completing it as needed. Would you be the correct contact to send this initial invite to, or someone else?
Additionally, could you confirm:
- Your company’s contractual address?
- If the attached screenshot would be accurate for your company?
Thanks!! Please let me know if you have any questions.
PAIGE SHERVANICK | Supply Chain Procurement Specialist
Northrop Grumman | Mission Systems
Phone: 703-561-5627 | paige.shervanick@ngc.com
--
Christopher Berger
por "Shervanick, Paige [US] (MS)" <Paige.Shervanick@ngc.com> - 01:56 - 18 feb. 2026 -
Update to the Automated Export System Trade Interface Requirements (AESTIR) Appendix O – DDTC ITAR Codes
Update to the Automated Export System Trade Interface Requirements (AESTIR) Appendix O – DDTC ITAR Codes
Update to the Automated Export System Trade Interface Requirements (AESTIR) Appendix O – DDTC ITAR Codes
February 18, 2026
*This message is being forwarded on behalf of the U.S. Customs and Border Protection*
CSMS # 67746241 - Update to the Automated Export System Trade Interface Requirements (AESTIR) Appendix O – DDTC ITAR Codes
AESTIR Appendix O has been updated to include International Traffic in Arms Regulations (ITAR) Exemption Code 126.9U - Temporary export, reexport, or temporary import of vessels described in USML Category XX(a)(10).Additional information about the ITAR exemption can be found:
- Federal Register
- DDTC website
- Fact sheet is here.
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