Info Inbox

From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:40 PM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

Thanks, Chris! Yes, if we would plan on you being onsite next Wed, that would be fantastic! Even if we get the machine running before then (Dave is back next Tues), it would be good peace of mind to have your expertise give the machine a good check-up.

 

Thanks!

 

Mike

 

MICHAEL WHITE | San Diego Manufacturing Engineering Manager

Northrop Grumman Corporation  |  Mission Systems

O: 858-592-3865  |  C: 858-472-1768  |  michael.a.white@ngc.com

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 2:21 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Dave,

 

I sent you a text message to check if you can access an assistant to reteach the cavity position for the BMC chip. This should address the pick-up issue. The mental issue I am having is since we only replaced the bond head I am not sure why it would be off. Even if you get the machine running which is priority #1 I think we should still plan for me to come onsite to do a thorough PM and calibration so we have a known good status of the system.

 

If you can't get it up and running I can probably be onsite next Wednesday.

 

Chris

 

On Wed, Feb 18, 2026 at 11:07 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:

Hi Chris,

 

The issue is the BMC tool stops about 0.020” short of the glass chip. This is the step immediately after I auto cal uses the TD tool to touch off in the BMC and find the circular fiducials.

 

I tried it over and over, every time the BMC stops short and throws a vacuum sensing error because it thinks it is picking up the chip but is not. 

 

Thank you,

 

Dave

 

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---

From: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Sent: Wednesday, February 18, 2026 9:47:33 AM
To: Christopher Berger <cberger@turnpack.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com <datacon@turnpack.com>
Subject: RE: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Hi Chris –

 

Admittedly, I’m not at all qualified to answer your question, though I’m certainly tracking the logic.

 

We’re at a critical point where it is imperative we get the machine back up and running ASAP. I know we have discussed the possibility of onsite support in the past. Is that still an option and, if so, could you provide an estimated date and a quote?

 

Many thanks!

 

Mike

 

MICHAEL WHITE | San Diego Manufacturing Engineering Manager

Northrop Grumman Corporation  |  Mission Systems

O: 858-592-3865  |  C: 858-472-1768  |  michael.a.white@ngc.com

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Wednesday, February 18, 2026 8:21 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Mike,

 

No worries. I just realized I typed up a reply to Dave last night in the text message but then got distracted and never hit send. The fact that it completes the first step with the touchdown tool and then fails the BMC pick-up is strange. Initially Dave didn't have the right Touchdown tool on hand and I can't remember if he did end up finding it. Can you confirm that the autocal is being performed with the below Touchdown tool and not the custom tool you use in production as TD tool.

 

 

Chris

 

On Wed, Feb 18, 2026 at 8:52 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:

Hi Chris –

 

Apologies for switching back over to e-mail (Dave informed me yesterday that you two were texting at this point), but Dave is out for a few days and I wanted to run a theory by you on the latest discovery on the machine. I’m assuming Dave let you know that he’s found the issue to be something to do with Z-axis. It’s not so much that the machine won’t pick up the chrome/glass chip due to vacuum (it will hold the part just fine if held directly to the nozzle, I’m told), but that the nozzle isn’t making contact with the chip.

 

The chip we are using is an older Besi PN, 04101310101. I’m told Besi has discontinued that part, with the new PN being 5001-9311. Long shot, but is there any chance there is a physical difference between the old and new part (thickness, maybe?) that could be contributing to this?

 

Sorry for the armchair QBing.

 

Mike

 

MICHAEL WHITE | San Diego Manufacturing Engineering Manager

Northrop Grumman Corporation  |  Mission Systems

O: 858-592-3865  |  C: 858-472-1768  |  michael.a.white@ngc.com

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Tuesday, February 17, 2026 1:27 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>; datacon@turnpack.com
Subject: EXT :Re: Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

David,

 

Sounds like you either have a vacuum issue for the component vacuum through the bond head or the BMC tool has some damage on it not sealing the vacuum properly when picking the BMC chip from the cavity. The Tool and Component vacuum are two separate lines.

 

Did you inspect the BMC tool surface?

 

Chris

 

On Tue, Feb 17, 2026 at 1:12 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:

Hi Chris,

 

Yes, the chip is there. I see what you mean about it having fiducials printed on it so you would know it is there. The chip stuck to my finger so I could lift it off. It is installed properly.

 

Today is the same as last Thursday. Starting auto-calibration, manually adjusting to the chip fiducials works but the chip is not being picked up. Vacuum on the tip feels strong on the BMC tip but vacuum through the tip does not appear to be enough to lift the chip. I am looking for an air leak. FYI, this machine has a vacuum pump, it does not use the vacuum port on the back of the machine.

 

Thank you,

 

Dave

 

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---

From: Christopher Berger <cberger@turnpack.com>
Sent: Monday, February 16, 2026 10:18:53 AM
To: White, Mike [US] (MS) <Michael.A.White@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

HI Mike,

 

To answer your questions yes that is the BMC Chip but from the pictures David sent I think you already have this part. When you look at this image in the email for the part what I was trying to point out is that this chip has fiducials on them and when you look closely you'll see that they are plated onto the glass chip on one side. When this chip is loaded into the cavity on the machine (between the bond force sensor and the mini-BMC plate) it needs to be inserted with the chrome fiducials facing down. (if it's loaded with the chrome facing up you'll get a parallax when the substrate camera performs measurements of the chip on the mini-BMC plate and it will also set the uplooking camera focus height incorrectly).

 

Hope this helps. You guys did great work on your own, you are almost there.

 

Chris

 

On Mon, Feb 16, 2026 at 11:09 AM White, Mike [US] (MS) <Michael.A.White@ngc.com> wrote:

All –

 

As always, thanks so much for your help and diligence on this! We have reached out to our NGC friends in Baltimore and they are sending us the component needed. See attached. Chris, can you confirm the PN Mark is sending us is what we need?

 

Thanks!

 

Mike

 

MICHAEL WHITE | San Diego Manufacturing Engineering Manager

Northrop Grumman Corporation  |  Mission Systems

O: 858-592-3865  |  C: 858-472-1768  |  michael.a.white@ngc.com

 

From: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Sent: Thursday, February 12, 2026 10:31 PM
To: Christopher Berger <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Hello Chris,

 

Your instruction, tool ID picture below and several hours of technical support today are very much appreciated. Thank you for the fantastic support!

 

You helped me complete all the BH calibration routines today requiring superuser access. The BH appears to be operating as it should be.

 

Unfortunately, I am still stuck on the last step of auto-calibration and know why. The chip you were telling me was to be picked up from the BMC and placed 10-20 times is not there. There is no one sided chrome piece and I do not recall it ever being there. I will ask our BWI operations if they can send us one. That is the very last step of calibration before testing the tool bank.

 

There was a glass slide over the force sensor but that shattered last year. I was advised it is not needed and have run force calibration since then with no issues. If I am mistaken and this is the piece you were talking about, please let me know and I can request it. The below statement from the machine basics manual and leads me to think it might be the glass slide I need.

 

 

Best regards,

 

Dave

 

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 2:54 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

David/Mike,

 

Sorry took me a bit longer to get the picture. Hope this helps

 

Chris

 

On Thu, Feb 12, 2026 at 10:10 AM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:

Hi Chris,

 

Thank you. The instructions are clear. I will verify we have the tilt calibration tool and if we have that I will get started on this.

 

Best regards,

 

Dave

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 12, 2026 7:27 AM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Hi David,

 

Attached is the procedure. Unfortunately, I don't have a Gen3 machine in the office to take pictures or screenshots for the procedure. Review it and let me know if you have any questions.

 

Chris

 

 

 

On Mon, Feb 9, 2026 at 6:19 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:

Hi Chris,

 

Good afternoon. On Friday, I tried to fix the theta offset by changing the values but did not have luck. Even when I had the BH tip and PU tool aligned, pick up still failed.

 

This morning, I noticed the BH tip spins freely, but when I change the direction of rotation, I feel a spot of resistance that goes away after 1 turn. Change rotation direction again and same result. I am speculating the internal encoder came loose. That would also help explain why the theta would not initialize for several days then started “working” again.

 

We have a bond head arriving from BWI as early as tomorrow. I received confirmation on which controller to purchase. We may have found one available.

 

Do you have any availability to come here and install the BH and Controller for us? If yes, may we please have a quote?

 

Our location is:

15120 Innovation Dr

San Diego, CA 92128

 

Thank you,

 

Dave Kellogg  |  Process Engineer

Northrop Grumman  |  Mission Systems

C: 858-860-9985  |  david.kellogg@ngc.com

 

 

 

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Friday, February 6, 2026 12:18 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :RE: Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Thanks for the update, Dave.

 

Good to know about the venturi setup, obviously a vacuum pump would be preferred. Let me know what you find with the module and if you need anything else from my side. Hope the theta offset fix gets you back up and running.

 

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

On Fri, Feb 6, 2026 at 12:25 PM David [US] (MS) Kellogg wrote:

Hi Chris,

 

It was great to speak with you and thanks for the troubleshooting advice and support. For the tip vacuum issue, please note our machine is not hooked up to a vacuum line, our machine uses a venturi to generate the vacuum. I am headed to the machine to look for the module and check it, and fix the theta offset.

 

Best regards,

 

Dave

 

From: Kellogg, David [US] (MS)
Sent: Friday, February 6, 2026 10:51 AM
To: 'Christopher Berger' <cberger@turnpack.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: RE: EXT :Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Hi Chris,

 

For our call I have added info to the log file timeline below.

 

Thank you,

 

Dave

 

Dave Kellogg  |  Process Engineer

Northrop Grumman  |  Mission Systems

C: 858-860-9985  |  david.kellogg@ngc.com

 

 

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 7:42 PM
To: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>
Cc: White, Mike [US] (MS) <Michael.A.White@ngc.com>; Werland, Jim [US] (MS) <jim.werland@ngc.com>
Subject: EXT :Re: C Calibration RE: NGC San Diego Besi Machine Support

 

Hi David,

 

Thanks for the break-down. It sounds like you have multiple things going on. It's probably easiest if we jump on a call tomorrow. I have a meeting from approx. 8am-9am PST but you can give me a call before or after that, just give me a heads-up. From reviewing the logfiles and your summary I am seeing this timeline of events. Let me know if this is incorrect. If the timeline is correct we should 'only' have to fix the 4deg offset and the tool detection?

Time	Event
~Jan 11	Warning precedes the alarm (customer report)
Jan 13 09:51	First theta homing failure — tracking error + current limit
Jan 13 11:16	Shifts to Error 62 (index pulse not found), Alarm 2.2609
Jan 13 15:16-15:20	Multiple init attempts, all fail with Error 62
Jan 13–~Jan 20	Alarm state persists for ~1 week
~Jan 20	Manual spinning + repeated calibration resolves 2.2609
~Jan 20 onward	Theta homed but ~4° off center
Jan 29 12:23	Air pressure alarms appear (Error 2.501) (This was purposeful. I disconnected the vacuum line to the bond tip to check vacuum was strong. We have had zero air pressure alarms otherwise.)
Jan 29 13:43	Additional Z-axis position loss (This was odd. I was working with our technician to run the machine for solder dispense only, but a Z-axis alarm appeared. Recalibration of the Z-axis resolved the issue and it has yet to reappear. I took it as a symptom of the larger issue we are trying to get to the root of).
Jan 29 14:07-14:11	Tool vacuum check fails repeatedly (75-78, threshold 25-50) (This is the current state. It was OK earlier this week.)
Jan 29 14:34-15:06	Autocalibration fails — can't detect touchdown tool (Missing the PU tool due to the theta axis being off center.)
Jan 29 15:25	Bond force calibration fails
Jan 29 15:27-15:45	Continued tool detection failures during production attempts

 

Chris

 

On Thu, Feb 5, 2026 at 7:49 PM Kellogg, David [US] (MS) <David.Kellogg@ngc.com> wrote:

Thank you, Jim!

 

Hi Chris,

 

Thank you offering to help with our machine woes. This has been an evolving issue since January 13^th.

 

System info:

MC4 Datacon 2200 evo Automatic Dispense and Component Placement System

SN: 9502610007253

Our machine uses System 2 only and a non-heated bond head with magazine fed waffle packs.

Log files from the beginning of the issue on 1/13 and as of last Friday 1/29 are attached. Nothing of note has changed since last Friday. The January superuser PW expired.

 

Symptoms:

1/13: Alarm 2.2609: Initialization failed, Axis MtPPThetaSys2 could not be initialized (IMG_4034.jpg). A warning preceded this alarm by a day or two.

This alarm state lasted several days, maybe a week. After manually spinning the bond head tip, running Theta Axis calibration, and running the initialization routine repeatedly, the 2.2609 alarm resolved itself and the machine would successfully initialize.

 

After the theta initialization alarm was resolved, the pickup tip was rotated off center about 4 degrees (picture attached). The PU tip is no longer aligned with the PP tool locating pins and cannot pick tools up. The machine provides a message to manually place the tip on the bond head. This worked until yesterday. Currently, the machine does not recognize a tip manually placed onto the bond head. Increased vacuum did not resolve the issue. I have verified the tip is firmly in place. Maybe it is the vacuum switch but odd it decided to fail now. There are no hose leaks I can see or hear. I need to trace this farther upstream.

 

Currently, I need February’s superuser PW so I can recalibrate the bond head tip back to zero degrees. A request for the PW was sent to Besi. I have the UC Calibration tool on hand for this. Once that is resolved, the issue of the PU tip not being recognized by the machine remains. I am cautiously optimistic this will resolve itself or a root cause will be found.

Lastly, it appears the air bearing in the bond head is good. I push it up and it goes down by itself, no sticking. IMG_4116 shows the TD sensor value.

 

Thank you again for your time on this. I really appreciate the support. I can provide more details as needed. I did not attach videos due to file size.

 

Best regards,

 

Dave Kellogg  |  Process Engineer

Northrop Grumman  |  Mission Systems

C: 858-860-9985  |  david.kellogg@ngc.com

 

 

From: Christopher Berger <cberger@turnpack.com>
Sent: Thursday, February 5, 2026 5:13 PM
To: Werland, Jim [US] (MS) <jim.werland@ngc.com>
Cc: Kellogg, David [US] (MS) <David.Kellogg@ngc.com>; White, Mike [US] (MS) <Michael.A.White@ngc.com>
Subject: EXT :NGC San Diego Besi Machine Support

 

Hi Jim,

 

Thanks for the intro. Looking forward to the details from Dave so we can get started. Here are a few things that may be helpful for me to understand what the issue:

• Machine Serial number and configuration (images would be helpful so I know what you in the machine)
• Description of the problem
• Screenshot of the errors
• Logfile

Thanks,

Chris

 

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

On Thu, Feb 5, 2026 at 17:48 PM Jim [US] (MS) Werland wrote:

Hi Christopher,

 

Thanks for your willingness to support our Besi machine that is currently non-operational.  I’m copying our process engineer, Dave Kellogg, who can provide more technical details related to the issues we’re experiencing.

 

Dave, please provide a quick summary of the current situation.

 

--Jim

 

JIM WERLAND   |   Director, NIC San Diego Manufacturing Engineering

Northrop Grumman Corporation   |   Mission Systems

O: 858-592-3288   |   C: 858-735-1286   |   jim.werland@ngc.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com

 

 

--

Christopher Berger

Phone: +1 (480) 331-1878

Cell: +1 (480) 273-4686

cberger@turnpack.com | www.turnpack.com