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[ Future Directions ] [[https://eps.ieee.org/?utm_source=ent+mkto&utm_medium=email&utm_campaign=3dic&utm_content=august+2026]]
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[ IEEE ] [[https://www.ieee.org/?utm_source=ent+mkto&utm_medium=email&utm_campaign=3dic&utm_content=august+2026]]
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[ PST 2026 ] [[https://3dic-conf.org/?utm_source=ent+mkto&utm_medium=email&utm_campaign=3dic&utm_content=august+2026]]
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IEEE International 3D Systems Integration Conference (3DIC)
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Dear Colleague,
The 2026 3DIC conference will be held 1-2 October at the Georgia Institute of Technology in Atlanta, GA
3DIC 2026 will cover all 3D system integration topics including 3D/2.5D process technology, interposers, and chiplets, materials, equipment, circuit technology, design methodology, and applications. Attendees will interact with researchers from all around the world.
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Abstract submission: Closed
Acceptance notifications: 14 September
Full camera-ready submissions due: 29 September
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