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ECTC 2026 Registration is Open!

The premier international conference for electronics packaging, components, and microelectronics systems technology.

ECTC brings together more than 2,000 professionals from across the global microelectronics and semiconductor packaging industry, including manufacturers, design houses, foundries, material suppliers, universities, and investors. This year the ECTC has over 450 technical papers covering advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high-speed and high-bandwidth, photonics, quantum electronics, flexible and printed electronics.

The ECTC 2026 Program Includes:

• 41 technical sessions with a total number of approximately 450 technical papers including:
  • 5 interactive presentation sessions, one of which is a student session
• 1 Keynote Speaker
• 12 special invited sessions plus a Young Professionals event
• 16 CEU-approved Professional Development Courses
• Student engagement programs to support workforce development
• Start-up Innovation Challenge
• ECTC Undergraduate/Master and PhD Students competition
• Thursday ECTC Reception Gala

With multiple opportunities for networking and a Technology Corner Exhibit that showcases industry-leading product and service companies from around the world, the ECTC is where you belong.

To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.

Conference Location

Special Sessions and Panels

2025 ECTC Keynote Talk 

Chair: Michael Mayer, University of Waterloo

2026 IEEE EPS President’s Panel Session - Data Centers in the Age of AI: Challenges and Solutions

Session Organizers: 

Jeff Suhling, Auburn University; David McCann, Amkor; Benson Chan, Binghamton University

Panel Moderator:

Kanad Ghose, Binghamton University

ECTC 2026 Plenary Session: Efficiency Is Not Enough: 

Are We Solving the Wrong in the Data Center Energy Use?

Session Chairs:

Masha Gorchichko, Applied Materials, Inc.

Jan Vardaman, TechSearch International, Inc.

Special Session 1: Quantum Infrastructure for AI Applications: Packaging Challenges and Roadmap

Session Chairs:

Rabindra N. Das, MIT Lincoln Laboratory

Pavel Roy Paladhi, NVIDIA 

Special Session 2: Engineering Next-Generation Packaging Technologies with Advanced Substrates and Panel-Level Integration

Session Chairs:

Markus Leitgeb, AT&S AG

Venkata RSS Mokkapati, AT&S AG 

Sponsored by Applied Materials and Rapidus Design Solutions

Special Session 3: AI-Enabled Electronic Design Automation for Multi-Physics Advanced Packaging 

Session Chairs:

Ian O'Connor, University of Lyon - Lyon Institute of Nanotechnology

Jose Schutt-Aine, University of Illinois

Special Session 4: Photonics-Based Systems for AI and Exascale Computing

Session Chairs:

Stephane Bernabe, CEA-LETI

Lars Brusberg, Corning Inc.

Special Session 5: System Integration Challenges of Large-Size and High-Power Components for High-Performance Computing and AI Applications

Session Chairs:

Tae-Kyu Lee, Cisco Systems, Inc. 

Eric Tremble, Marvell Technology, Inc. 

Sponsored by Zymet

Special Session 6: Electrical-Thermal-Mechanical Co-Design in High-Performance Packaging

Session Chairs:

Tiwei Wei, University of California, Los Angeles

Ning Ye, Sandisk Technologies, Inc.

Sponsored by Zymet

Special Session 7: Enabling Next-Generation Advanced Packaging Technology from Wafer to Panel

Session Chairs:

Kuldip Johal, MKS Instruments

Beth Keser, Volantis Semiconductor

 
Sponsored by Binghamton University

Special Session 8: Innovative Materials for Advanced Packaging – Materials for Packaging, Integration, and Performance

Session Chairs:

Zia Karim, Yield Engineering Systems

Ksenija Varga, EV Group

2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop

Session Chairs: 

Ravi Mahajan, Intel Corporation

William Chen, ASE

2026 ECTC Young Professional Networking Event 

Session Chair: Aakrati Jain, IBM

2026 IEEE EPS Seminar: Redefining System Integration: 

The Rise of Organic Substrates in the Chiplet Era

Session Chairs:

Takashi Hisada, Rapidus Corporation

Yasumitsu Orii, Rapidus Corporation

ECTC 2026 Student Challenge

Session Chairs:

Przemyslaw Gromala, Robert Bosch GmbH

Ibrahim Guven, Virginia Commonwealth University

Start Up Competition: The Light Age: 

Strategic Investment in Photonics to Power the Next Computing Era

Session Chairs:

Rozalia Beica, Rapidus Design Solutions

Farhang Yazdani, BroadPak Corporation

 Professional Development Courses

PDC Chairs:

Kitty Pearsall, Capstan Technologies, Inc.

Jeff Suhling, Auburn University

MORNING COURSES 8:00 AM – 12:00 PM

Visit the ECTC PDC page for full description on the courses and instructor’s bio.

1. High Reliability Soldering in Advanced Semiconductor Packaging
Course Leader: Ning-Cheng Lee, ShinePure Hi-Tech

2. Photonic Components and Packaging Technologies for Data Center, Communication, Sensing, and Displays
Course Leader: Torsten Wipiejewski, Huawei Technologies Duesseldorf GmbH

3. Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging
Course Leader: Viorel Dragoi, EV Group

4. Introduction to Quality and Reliability Engineering of Advanced Microelectronics Packaging
Course Leaders: Shubhada Sahasrabudhe, QuRIuS LLC; Shalabh Tandon, QuRIuS LLC

5. 2.5D/3D Package Failure Analysis - Failure Mechanisms and Analytical Tools
Course Leader: Deepak Goyal, Carl Zeiss, Inc.

6. AI-Applications in Semiconductor Packaging
Course Leader: Pradeep Lall, Auburn University

7. Fundamentals of Fabrication Processes and RF Design of Advanced Packages Including Fan-Out, Chiplets, Glass and Polymer Interposers
Course Leaders: Ivan Ndip, Brandenburg University of Technology/Fraunhofer IZM; Markus Woehrmann, Fraunhofer IZM

8. Electronics Cooling and Reliability for Data Centers
Course Leader: Patrick McCluskey, University of Maryland, College Park

AFTERNOON COURSES 1:30 PM – 5:30 PM

9. Polymers for Advanced Packaging

Course Leader: Jeff Gotro, InnoCentrix, LLC

10: Diamond Heat Spreaders and Heterogeneous Integration

Course Leader: Joana-Catarina Mendes, Instituto de Telecomunicaciones

11: Advanced Packaging for Chiplet, Heterogeneous Integration, and Co-Packaged Optics

Course Leader: John H. Lau, Unimicron Technology Corp.

12: Preventing Packaging Failure - Modeling and Mitigation Strategies for Warpage, Fatigue, and Thermal Issues

Course Leader: Xuejun Fan, Lamar University

13: Failure Analysis of Engineering Materials for Advanced Electronic Packaging

Course Leader: Kuan Yew Cheong, Universiti Sains Malaysia

14: Flip Chip Technologies

Course Leader: Shengmin Wen, TATA Electronics Private Limited

15: Advanced Packaging for 5G/6G - RF Focus

Course Leader: Premjeet Chahal, Michigan State University

16: Thermal Management in the Age of AI

Course Leader: Jaime Sanchez, Lightmatter, Inc

Come to ECTC and Visit More Than 135 Exhibitors

The ECTC Exhibition will showcase more than 135 companies and organizations representing the full spectrum of materials, services, equipment, and products for the electronic packaging industry. Complementing the strength of the ECTC technical program, the Exhibition provides an unparalleled opportunity for engineers and decision makers to discuss and collaborate with representatives from leading electronic packaging companies. 

For more information on exhibiting opportunities, contact Chris Bower, ECTC Exhibits Chair. 

For more information on the 2026 ECTC visit www.ectc.net.

Also, see some of the 2025 ECTC Highlights.

Learn more about the packaging innovations and the ECTC role over the last 75 years here. 

Become an ECTC Sponsor: Don't miss this great opportunity!

See ECTC pictures via Flickr and be sure to join the ECTC via LinkedIn.

Thanks to Our 2026 Sponsors