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Confirmation for Your Order PO26131681
Thank you for your order. We will deliver your items tomorrow between 2 and 4 pm.Confirmation
Delivery address
Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142
Attention: Suite 104Billing address
Turnpack LLC
22425 S Scotland CT Ste 104
Queen Creek AZ 85142Delivery method
StandardOrder date
3/31/2026Payment method
InvoicePlaced by
Christopher BergerMcMaster-Carr number
5104384PO26131681 Delivers Apr 1, 2-4 pm 1 Multipurpose 6061 Aluminum Bar
3/8" Thick x 1-3/4" Wide, 1 Foot Long
8975K6161
each9.80
each$9.80 2 Multipurpose 6061 Aluminum Bar
1/4" Thick x 3/4" Wide, 1 Foot Long
8975K5941
each3.25
each$3.25 3 Multipurpose 6061 Aluminum Bar
3/4" Thick x 1-1/4" Wide, 1 Foot Long
8975K4861
each14.53
each$14.53 4 Push-to-Connect Tube Fitting for Air
90 Degree Swivel Elbow, for 4mm Tube OD, M3 x 0.5mm Male
5225K7392
each9.75
each$19.50 5 Multipurpose 6061 Aluminum Bar
1-1/4" Thick x 1-3/4" Wide, 2 Feet Long
8975K9391
each56.07
each$56.07 6 Multipurpose 6061 Aluminum Bar
1-1/4" Thick x 1-3/4" Wide x 8 Feet Long
8975K9391
each164.10
each$164.10 7 Multipurpose 6061 Aluminum Bar
1-1/8" Thick x 1-1/8" Wide x 2 Feet Long
9008K861
each37.36
each$37.36 8 Multipurpose 6061 Aluminum Bar
1-1/8" Thick x 1-1/8" Wide x 8 Feet Long
9008K861
each109.33
each$109.33 9 316 Stainless Steel Corrosion-Resistant Compression Springs
4.400 mm Long, 1.920 mm OD, 1.280 mm ID
8969T2892
packs of 14.88
pack$9.76 10 Multipurpose 6061 Aluminum Bar
1/2" Thick x 1-1/2" Wide, 6 Feet Long
8975K421
each53.43
each$53.43 Merchandise 477.13 Shipping 158.98 Total $636.11 Your order is subject only to our terms and conditions, available at www.mcmaster.com or from our Sales Department. Phone: (562) 692-5911 Email: la.sales@mcmaster.com
by "McMaster-Carr" <la.sales@mcmaster.com> - 06:46 - 31 Mar 2026 -
Your shipment was delivered 870028928237
FedEx
Your shipment was delivered. Delivery Date Tue, 03/31/2026
1:34pm
Delivered to 871 CORPORATE WAY, Fremont, CA 94539 Received by JJEFF Report missing package How was your delivery? 
Personal message return thermode on SO2603997 Tracking details Tracking ID 870028928237 From christopher berger
22425 S SCOTLAND CT
Suite 104
QUEEN CREEK, AZ, US
85142To Jeff Berlin
871 Corporate Way
Fremont, CA, US
94539Ship date Thu 3/26/2026 12:00 AM Number of pieces 1 Total shipment weight 2.00 LB Service FedEx Ground Reference return thermode Purchase order number SO2603997 TRACK SHIPMENT 
Put shipping power in your palm The free FedEx® Mobile app allows you to measure package dimensions, create labels, use QR codes for printerless shipping, find rates, manage pickups, and more. DOWNLOAD THE APP This tracking update has been requested by: Company name christopher berger Name Turnpack LLC Email info@turnpack.com 
Please do not respond to this message. This email was sent from an unattended mailbox. This report was generated at approximately 3:46 PM CDT 03/31/2026.All weights are estimated.
To track the latest status of your shipment, click on the tracking number above.
Standard transit is the date and time the package is scheduled to be delivered by, based on the selected service, destination and ship date. Limitations and exceptions may apply. Please see the FedEx Service Guide for terms and conditions of service, including the FedEx Money-Back Guarantee, or contact your FedEx Customer Support representative.
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Thank you for your business.
ID 1026
by "FedEx Tracking" <TrackingUpdates@fedex.com> - 04:46 - 31 Mar 2026 -
Your order from DATRON CNC Milling Tools is on its way!
DATRON CNC Milling Tools
Good things are heading your way!
Hi Christopher,
We have finished processing your order.
Here’s a reminder of what you’ve ordered:
Tracking Information
Provider Tracking Number Date 9405536105441276051938 Track
Order summary
Order #25314 ()Product Quantity Price 
Thread Mill
Thread: M2.5-M4
Cutting Diameter (D1): 2mm
Shank (D2): 3mm
D3: 1mm
Length (L1): 40mm
Cutting Depth (L2): 0.2mm
L3: 12mm
Flutes: 4
α: 60°
Tariff Surcharge: $18.00×2 $150.02
Subtotal: $150.02 Shipping: Free Ground Shipping Free Ground Shipping Tariff Surcharge: $18.00 Tax: $0.00 Total: $168.02 Payment method: Credit Card
Billing address Christopher Berger
Turnpack
22425 S Scotland Ct
Suite 104
Queen Creek, AZ 85140
United States (US)
4803311878
info@turnpack.comShipping address Christopher Berger
Turnpack
22425 S Scotland Ct
Suite 104
Queen Creek, AZ 85140
United States (US)Thanks for shopping with us.
Your order has been charged to your credit card and no further payment is due.
Please note that sales tax will be applied to Colorado orders beginning June 1st.
DATRON CNC Milling Tools — https://shop.datron.com/
Read our tool refund and returns policy
by "DATRON Dynamics" <orders@datron.com> - 04:41 - 31 Mar 2026 -
Your Package Arrives Tomorrow
UPS
Hi LorenaCarrillo, Your package is arriving tomorrow. From DIGI-KEY Estimated Delivery Wednesday 04/01/2026
between 9:30 AM - 11:30 AMChange Delivery Ship To 22425 S SCOTLAND CT
STE 104
QUEEN CREEK, AZ 85142
USUPS 2nd Day Air® 1Z5674320242930899 Reference Number: 123070910 1 You will be prompted to accept Terms and Conditions to change delivery.
by "UPS" <mcinfo@ups.com> - 03:51 - 31 Mar 2026 -
Your Package Was Delivered
UPS
Hi LorenaCarrillo, Your package was delivered. From AMAZON.COM Delivered Tuesday 03/31/2026
11:25 AMShip To 22425 S SCOTLAND CT STE 104
QUEEN CREEK, AZ 851421056
USUPS Ground 1ZX350640366898431 Reference Number: 1086080073805002
by "UPS" <mcinfo@ups.com> - 02:46 - 31 Mar 2026 -
RE: part
From: info@turnpack.com <info@turnpack.com>
Sent: Tuesday, March 31, 2026 2:39 PM
To: Blewett, Tim <blewett@ddc-web.com>
Subject: RE: part!! Caution: External Sender !! Do not click links or open attachments unless you verify the sender.
Do you have a photo or see a part number on it somewhere?
From: Blewett, Tim <blewett@ddc-web.com>
Sent: Tuesday, March 31, 2026 10:38 AM
To: info@turnpack.com
Subject: partGood afternoon,
We have a HGRS-V and looking for the knob with the button on the stage
Thank you,
Timothy P. Blewett
Facilities Technician Sr.
Data Device Corporation
T: 631-567-5600 ext 7444
Your solution provider... for Connectivity, Power, and Control
Notice: This e-mail and any files transmitted with it may contain Data Device Corporation's and its subsidiaries privileged and proprietary information. It is intended solely for the use of the individual or entity to whom it is addressed. If you are not the named recipient of this transmission, any disclosure, copying, distribution or reliance on the contents of this message is prohibited. If you received this e-mail in error, please destroy it and any attached files and notify me immediately.
Click Here to view our privacy statement.
!! Caution: External Sender !! Do not click links or open attachments unless you verify the sender.
________________________________
Sent from my iPhone
by Tim Blewett - 02:46 - 31 Mar 2026 -
Fast-Track Your Way to Precise, Efficient Positioning Tables
Fast-Track Your Way to Precise, Efficient Positioning Tables
IKO is launching a new production and stocking program — FastTrack — to deliver or make popular TU and TE Series ball-screw driven positioning tables in as little as two weeks. Other products are also negotiable. With FastTrack, you can avoid the sometimes inconvenient lead times that may otherwise occur with standard order fulfillment options. In these days of supply chain disruptions and unexpected delays, you simply want peace of mind that your order is fulfilled promptly. Not only does our new FastTrack program save valuable time, it’s another example of our continuing commitment to enhancing your purchasing experience. This blog post will explain how FastTrack works.
by "IKO International, Inc." <eco+ikonet.co.jp.126@2164376.emcampaign.com> - 02:07 - 31 Mar 2026 -
Re: part
Hi Tim,I will send you a quote for the requested items today.ChrisOn Tue, Mar 31, 2026 at 10:51 AM Blewett, Tim <info@turnpack.com> wrote:Good afternoon,
We have a HGRS-V and looking for the knob with the button on the stage
Thank you,
Timothy P. Blewett
Facilities Technician Sr.
Data Device Corporation
T: 631-567-5600 ext 7444
Your solution provider... for Connectivity, Power, and Control
Notice: This e-mail and any files transmitted with it may contain Data Device Corporation's and its subsidiaries privileged and proprietary information. It is intended solely for the use of the individual or entity to whom it is addressed. If you are not the named recipient of this transmission, any disclosure, copying, distribution or reliance on the contents of this message is prohibited. If you received this e-mail in error, please destroy it and any attached files and notify me immediately.
Click Here to view our privacy statement.
--Christopher Berger
by Chris Berger - 01:56 - 31 Mar 2026 -
Your Package Is Coming Today
UPS
Hi LorenaCarrillo, Your package is arriving today. From AMAZON.COM Estimated Delivery Tuesday 03/31/2026
between 9:30 AM - 11:30 AMChange Delivery Ship To 22425 S SCOTLAND CT STE 104
QUEEN CREEK, AZ 851421056
USUPS Ground 1ZX350640366898431 Reference Number: 1086080073805002 You will be prompted to accept Terms and Conditions to change delivery.
by "UPS" <mcinfo@ups.com> - 01:46 - 31 Mar 2026 -
part
Good afternoon,
We have a HGRS-V and looking for the knob with the button on the stage
Thank you,
Timothy P. Blewett
Facilities Technician Sr.
Data Device Corporation
T: 631-567-5600 ext 7444
www.ddc-web.com
Your solution provider... for Connectivity, Power, and Control
Notice: This e-mail and any files transmitted with it may contain Data Device Corporation's and its subsidiaries privileged and proprietary information. It is intended solely for the use of the individual or entity to whom it is addressed. If you are not the named recipient of this transmission, any disclosure, copying, distribution or reliance on the contents of this message is prohibited. If you received this e-mail in error, please destroy it and any attached files and notify me immediately.
Click Here to view our privacy statement.
by Tim Blewett - 01:41 - 31 Mar 2026 -
Your shipment was delivered 792198133740
FedEx
Hi, Turnpack LLC. Your shipment from Arch Cutting Tools was delivered. Delivered Date Tue, 03/31/2026
10:23am
Delivered to 22425 S SCOTLAND CT, Queen Creek, AZ 85142 Received by SAREVELLO Report missing package How was your delivery?
Tracking details Tracking ID 792198133740 From Arch Cutting Tools
5 INDUSTRIAL WAY
CORNISH, ME, US
04020To christopher berger
22425 S SCOTLAND CT
Suite 104
QUEEN CREEK, AZ, US
85142Ship date Tue 3/24/2026 12:00 AM Number of pieces 1 Total shipment weight 5.00 LB Service FedEx Ground Purchase order number PO26081610 TRACK SHIPMENT 
Put shipping power in your palm The free FedEx® Mobile app allows you to measure package dimensions, create labels, use QR codes for printerless shipping, find rates, manage pickups, and more. DOWNLOAD THE APP
Please do not respond to this message. This email was sent from an unattended mailbox. This report was generated at approximately 12:29 PM CDT 03/31/2026.All weights are estimated.
To track the latest status of your shipment, click on the tracking number above.
Standard transit is the date and time the package is scheduled to be delivered by, based on the selected service, destination and ship date. Limitations and exceptions may apply. Please see the FedEx Service Guide for terms and conditions of service, including the FedEx Money-Back Guarantee, or contact your FedEx Customer Support representative.
© 2026 Federal Express Corporation. The content of this message is protected by copyright and trademark laws under U.S. and international law. Review our FedEx Delivery Manager® Privacy Notice and Opt Out Preference. Find information on fraud and security. All rights reserved.
Thank you for your business.
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ID 1026
by "FedEx Delivery Manager" <TrackingUpdates@fedex.com> - 01:31 - 31 Mar 2026 -
RE: Gusto Entries since Oct 2025
Hi Lorena,
Can you clarify what report you are looking for? The screenshot you attached is an automatic journal entry from Gusto that properly breaks out the payroll expenses into their correct expense accounts. Do you need a payroll report from Gusto?
Thanks,
Kristina
Kristina Alley, EA
Tax/Accounting Senior Associate
www.chandleraccountant.com
Office- 480-779-4222
Fax – 480-779-4223290 W. Chandler Heights Road, Suite 1 Chandler, AZ 85248
3336 E. Chandler Heights Road, Suite 104 Gilbert, AZ 85298
Submit your documents via any of the following methods:
· Secure Client Portal (SmartVault) - Please upload the documents securely through your SmartVault client portal at https://www.smartvault.com/ Your username is your email. If you do not remember your password, click the “Can’t sign in” option. If you do not have a SmartVault account or cannot locate your invitation, please contact our office and we will be happy to resend it.
· Hightail - https://www.hightail.com/u/schneiderstone
· In person or by Mail – you may drop off or mail your documents to either of our office locations:
o Chandler: 290 W. Chandler Heights Rd. Ste 1, Chandler, AZ 85248
o Gilbert: 3336 E. Chandler Heights Rd. Ste 104, Gilbert, AZ 85298
· Email – you may email the information; however, please do not include documents with sensitive personal information via email
From: info@turnpack.com <info@turnpack.com>
Sent: Tuesday, March 31, 2026 10:16 AM
To: Kristina Alley <Kristina@chandleraccountant.com>
Cc: 'Christopher Berger' <cberger@turnpack.com>; Ryan Stone <ryan@chandleraccountant.com>
Subject: Gusto Entries since Oct 2025Hi Kristina, could you please send me a report of each of the Gusto withdrawals on the account since October so I can enter into our other system. When they are grouped together I can’t tell what goes where. Please do not group if possible unless you’re also able to send me a report.
Lorena Carrillo
Office Manager
Office: 480-331-1878
Line: 781-938-006922425 S Scotland Ct, Suite104, Queen Creek, AZ 85142
lcarrillo@turnpack.com | www.turnpack.com
https://www.turnpack.com/midas-rework/delidder
by Kristina Schneider - 01:31 - 31 Mar 2026 -
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Learn More About Costco Business Center ❯ 🌸🐰 Costco Business Center will be closed on Easter Sunday, April 5, 2026. Get More From Your Membership Same Day
Auto RenewalCostco AppProduct specifications, availability and prices are subject to change without notice.
Savings Event Instant Savings are valid only April 6 - May 3, 2026 at Costco Business Center and CostcoBusinessDelivery.com. A valid Costco membership is required. State law may require sales tax to be charged on the pre-discounted price if the product is subject to sales tax. These taxes, if any, are in addition to the amount you are paying for the product. Quantities are limited. Item limits apply, per member. Instant Savings limited to inventory available from manufacturer. No rain checks will be issued for out of stock items. All Instant Savings are available for delivery unless indicated. Delivery orders must be placed online at CostcoBusinessDelivery.com or SameDay.CostcoBusinessDelivery.com to receive Instant Savings. Savings are not available on Costco.com and may not be combined with any other Instant Savings or coupon. Cigarette items are for resale only. No cash redemption.
In the past you provided Costco with your email address info@turnpack.com. Occasionally, you will receive brief advertising announcements regarding special items and services. If you prefer not to receive these advertisements, please click unsubscribe to send an email requesting to be removed.
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by "Costco Business Center" <Costco@digital.costco.com> - 01:12 - 31 Mar 2026 -
Today's Graphite Connect Activity
Hi Lorena Carrillo,Here's your weekly digestfor Turnpack, LLCMy Items 0 of 0Task Breakdown
All tasks
1
New
1
At risk
0
Overdue
0
On hold
0© 2026 Graphite Systems Inc.3400 Ashton Blvd, #220 Lehi, UT 84048Learn more about Graphite Connect at graphiteconnect.com
by "graphiteConnect" <no-reply@graphiteconnect.com> - 12:21 - 31 Mar 2026 -
ECTC 2026 Advance Program Is Now Available
ECTC 2026 Registration is Open!
The premier international conference for electronics packaging, components, and microelectronics systems technology.
ECTC brings together more than 2,000 professionals from across the global microelectronics and semiconductor packaging industry, including manufacturers, design houses, foundries, material suppliers, universities, and investors. This year the ECTC has over 450 technical papers covering advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high-speed and high-bandwidth, photonics, quantum electronics, flexible and printed electronics.
Registration Patron: Zymet
The ECTC 2026 Program Includes:
- 41 technical sessions with a total number of approximately 450 technical papers including:
- 5 interactive presentation sessions, one of which is a student session
- 1 Keynote Speaker
- 12 special invited sessions plus a Young Professionals event
- 16 CEU-approved Professional Development Courses
- Student engagement programs to support workforce development
- Start-up Innovation Challenge
- ECTC Undergraduate/Master and PhD Students competition
- Thursday ECTC Reception Gala
With multiple opportunities for networking and a Technology Corner Exhibit that showcases industry-leading product and service companies from around the world, the ECTC is where you belong.
To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.
Conference Location
JW Marriott & The Ritz-Carlton Grande Lakes Resort
4040 Central Florida Parkway,
Orlando, Florida, USA, 32837For more information on booking a hotel room please visit our website here!
Special Sessions and Panels
2025 ECTC Keynote Talk
Chair: Michael Mayer, University of Waterloo
Keynote Speaker: Tien Wu, CEO of Advanced Semiconductor Engineering, Inc
Abstract
Advanced Packaging and the Future of System Optimization
Global AI infusion is redefining performance, power, and integration requirements, placing advanced packaging at the forefront of semiconductor innovation. As chip architecture complexity increases, the industry is progressing beyond device-level scaling toward system-level optimization. Advances in heterogeneous integration and packaging-enabled co-design are shaping more efficient, scalable, and resilient systems. Moving forward, system-centric strategies that align architecture, packaging, and collaboration across the ecosystem are paramount to shaping the golden era of AI and semiconductors.
2026 IEEE EPS President’s Panel Session - Data Centers in the Age of AI: Challenges and Solutions
Session Organizers:
Jeff Suhling, Auburn University; David McCann, Amkor; Benson Chan, Binghamton University
Panel Moderator:
Kanad Ghose, Binghamton University
ECTC 2026 Plenary Session: Efficiency Is Not Enough:
Are We Solving the Wrong Problem in the Data Center Energy Use?
Session Chairs:
Masha Gorchichko, Applied Materials, Inc.
Jan Vardaman, TechSearch International, Inc.
Special Session 1: Quantum Infrastructure for AI Applications: Packaging Challenges and Roadmap
Session Chairs:
Rabindra N. Das, MIT Lincoln Laboratory
Pavel Roy Paladhi, NVIDIA
Special Session 2: Engineering Next-Generation Packaging Technologies with Advanced Substrates and Panel-Level IntegrationSession Chairs:
Markus Leitgeb, AT&S AG
Venkata RSS Mokkapati, AT&S AG
Sponsored by Applied Materials and Rapidus Design Solutions
Special Session 3: AI-Enabled Electronic Design Automation for Multi-Physics Advanced Packaging
Session Chairs:
Ian O'Connor, University of Lyon - Lyon Institute of Nanotechnology
Jose Schutt-Aine, University of Illinois
Special Session 4: Photonics-Based Systems for AI and Exascale Computing
Session Chairs:
Stephane Bernabe, CEA-LETI
Lars Brusberg, Corning Inc.
Special Session 5: System Integration Challenges of Large-Size and High-Power Components for High-Performance Computing and AI Applications
Session Chairs:
Tae-Kyu Lee, Cisco Systems, Inc.
Mike Gallagher, Qnity
Sponsored by ZymetSpecial Session 6: Electrical-Thermal-Mechanical Co-Design in High-Performance Packaging
Session Chairs:
Tiwei Wei, University of California, Los Angeles
Ning Ye, Sandisk Technologies, Inc.
Sponsored by Zymet
Special Session 7: Enabling Next-Generation Advanced Packaging Technology from Wafer to Panel
Session Chairs:
Kuldip Johal, MKS Instruments
Beth Keser, Volantis Semiconductor
Sponsored by Binghamton UniversitySpecial Session 8: Innovative Materials for Advanced Packaging – Materials for Packaging, Integration, and Performance
Session Chairs:
Zia Karim, Yield Engineering Systems
Ksenija Varga, EV Group
2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop
Session Chairs:
Ravi Mahajan, Intel Corporation
William Chen, ASE
2026 ECTC Young Professional Networking Event
Session Chair: Aakrati Jain, IBM
2026 IEEE EPS Seminar: Redefining System Integration:
The Rise of Organic Substrates in the Chiplet Era
Session Chairs:
Takashi Hisada, Rapidus Corporation
Yasumitsu Orii, Rapidus Corporation
ECTC 2026 Student Challenge
Session Chairs:
Przemyslaw Gromala, Robert Bosch GmbH
Ibrahim Guven, Virginia Commonwealth University
Start Up Competition: The Light Age:Strategic Investment in Photonics to Power the Next Computing Era
Session Chairs:
Rozalia Beica, Rapidus Design Solutions
Farhang Yazdani, BroadPak Corporation
Professional Development Courses
PDC Chairs:
Kitty Pearsall, Capstan Technologies, Inc.
Jeff Suhling, Auburn University
MORNING COURSES 8:00 AM – 12:00 PM
Visit the ECTC PDC page for full description on the courses and instructor’s bio.
1. High Reliability Soldering in Advanced Semiconductor Packaging
Course Leader: Ning-Cheng Lee, ShinePure Hi-Tech
2. Photonic Components and Packaging Technologies for Data Center, Communication, Sensing, and Displays
Course Leader: Torsten Wipiejewski, Huawei Technologies Duesseldorf GmbH
3. Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging
Course Leader: Viorel Dragoi, EV Group
4. Introduction to Quality and Reliability Engineering of Advanced Microelectronics Packaging
Course Leaders: Shubhada Sahasrabudhe, QuRIuS LLC; Shalabh Tandon, QuRIuS LLC
5. 2.5D/3D Package Failure Analysis - Failure Mechanisms and Analytical Tools
Course Leader: Deepak Goyal, Carl Zeiss, Inc.
6. AI-Applications in Semiconductor Packaging
Course Leader: Pradeep Lall, Auburn University
7. Fundamentals of Fabrication Processes and RF Design of Advanced Packages Including Fan-Out, Chiplets, Glass and Polymer Interposers
Course Leaders: Ivan Ndip, Brandenburg University of Technology/Fraunhofer IZM; Markus Woehrmann, Fraunhofer IZM
8. Electronics Cooling and Reliability for Data Centers
Course Leader: Patrick McCluskey, University of Maryland, College ParkAFTERNOON COURSES 1:30 PM – 5:30 PM
9. Polymers for Advanced Packaging
Course Leader: Jeff Gotro, InnoCentrix, LLC
10: Diamond Heat Spreaders and Heterogeneous Integration
Course Leader: Joana-Catarina Mendes, Instituto de Telecomunicaciones
11: Advanced Packaging for Chiplet, Heterogeneous Integration, and Co-Packaged Optics
Course Leader: John H. Lau, Unimicron Technology Corp.
12: Preventing Packaging Failure - Modeling and Mitigation Strategies for Warpage, Fatigue, and Thermal Issues
Course Leader: Xuejun Fan, Lamar University
13: Failure Analysis of Engineering Materials for Advanced Electronic Packaging
Course Leader: Kuan Yew Cheong, Universiti Sains Malaysia
14: Flip Chip Technologies
Course Leader: Shengmin Wen, TATA Electronics Private Limited
15: Advanced Packaging for 5G/6G - RF Focus
Course Leader: Premjeet Chahal, Michigan State University
16: Thermal Management in the Age of AI
Course Leader: Jaime Sanchez, Lightmatter, Inc
Come to ECTC and Visit More Than 135 Exhibitors
The ECTC Exhibition will showcase more than 135 companies and organizations representing the full spectrum of materials, services, equipment, and products for the electronic packaging industry. Complementing the strength of the ECTC technical program, the Exhibition provides an unparalleled opportunity for engineers and decision makers to discuss and collaborate with representatives from leading electronic packaging companies.
For more information on exhibiting opportunities, contact Chris Bower, ECTC Exhibits Chair.
For more information on the 2026 ECTC visit www.ectc.net.
Also, see some of the 2025 ECTC Highlights.
Learn more about the packaging innovations and the ECTC role over the last 75 years here.
Become an ECTC Sponsor: Don't miss this great opportunity!
See ECTC pictures via Flickr and be sure to join the ECTC via LinkedIn.
Thanks to Our 2026 Sponsors
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by "IEEE Electronics Packaging Society" <ieee-eps@deliver.ieee.org> - 10:31 - 31 Mar 2026 - 41 technical sessions with a total number of approximately 450 technical papers including:
-
Ship Notification: Shipment for Order W025314 was processed
Ship to:
Christopher Berger
22425 S Scotland Ct, Suite 104
Queen Creek, AZ 851421042
UNITED STATES
(480) 331-1878
DATRON USA Inc is pleased to inform you that the shipment for your order(s) W025314 has been processed using USPS (USPS Priority Mail®) service. The physical package(s) may or may not have actually been tendered to USPS for the shipment.
Your shipment contains 1 packages with master tracking number 9405536105441276051938, estimated delivery is 04/02/2026.
Pkg #
Tracking Number
1
9405536105441276051938 Item #
Description
Qty Ordered
Qty Shipped
0068420L M2.5 - M4 TM x 3mm 2
2
/TARIFF Tariff Surcharge 1
1
We appreciate your business,
DATRON USA Inc
115 Emerson Rd
Milford, NH 030553583
UNITED STATES
(603) 215-5850
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by eNotify@starship.online - 09:16 - 31 Mar 2026
