Info Inbox

Following up on the Datacon 2200 EVO die bonder for expected Q4 2026 release.

The machine is seller-reported working and offered as-is, where-is,
subject to final availability and configuration confirmation.

Does this platform fit your current buying requirements? Please
indicate any generation, bond-head, dispensing or handling
requirements needed to assess the machine and submit an indicative
offer.

On Thu, 17 Sep 2026 16:21:28 -0500, Dmitrius Garcia
<D.Garcia@fabexchange.com> wrote:

> We have a Datacon 2200 EVO die-bonding system expected to become available in Q4 2026.

>

> The system is seller-reported working. We are currently verifying the included bond-head, dispensing, vision, wafer-handling and related operating configuration before release.

>

> Because your organization works with Datacon/Besi equipment, I wanted to approach you directly before taking the system to the broader equipment market.

>

> If there is acquisition interest, I can provide photographs and the available configuration information for technical review.

>

> The system will be offered as-is, where-is. I’d be interested in where you would be on a direct inventory purchase once the configuration is confirmed.