Archivados
Info Inbox
info@turnpack.com
IMAPS Symposium 2026 (Booth #418)
Will you be at IMAPS Symposium 2026?
Electroninks will be presenting new performance data on spray-deposited Metal-Organic Decomposition (MOD) silver for backside metallization (BSM), jointly evaluated with ASE for Indium metal TIM integration.
The work demonstrates a production-oriented approach to BSM that combines strong reliability performance with scalable, atmospheric processing — without the need for vacuum equipment.
Join our technical presentation:
Spray Deposited MOD Silver BSM Demonstrates Production-ready Performance for Indium Metal TIM Integration White Enabling Scalable Atmospheric Processing.
Speaker: Dr. Kang-Yu Liu, Taiwan Application Development Manager, Electroninks
Date: Wednesday, September 30, 2026
Time: 4:00-4:25 PM
Location: Cezanne 1-2, Encore Boston Harbor
For advanced RF, logic, and high-power packages, our approach offers a potential path to reduce vacuum-processing requirements and capital constraints while maintaining the reliability needed for advanced thermal management.
If you’ll be attending IMAPS, we’d love to connect.
Visit us at booth #418
Learn more about Electroninks at https://electroninks.com/
We look forward to seeing you in Boston!
Thank you,
Avery Gerber, Sales and Marketing Associate
7901 E. Riverside Dr. | Building 1, Unit 150
Austin, Texas 78744
Office: 512-766-7555 | Direct: (512) 790-0995
This e-mail is strictly confidential and intended solely for the intended recipient and may contain privileged, proprietary, or otherwise confidential information under applicable law. If you are not the intended recipient, any disclosure, copying, distribution or any action taken or omitted to be taken in reliance on it, is prohibited and may be unlawful, and, Electroninks Incorporated and/or any of its subsidiaries or affiliated companies shall not be held liable for any misuse of this message. If you have received this message by mistake, please notify the sender immediately and destroy all copies of this message, including attachments, without making any copy of any kind.
por "Avery Gerber" <A.Gerber@electroninks.com> - 02:33 - 25 sep. 2026