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IMAPS Symposium 2026 (Booth #418)
Will you be at IMAPS Symposium 2026?
Electroninks will be presenting new performance data on spray-deposited Metal-Organic Decomposition (MOD) silver for backside metallization (BSM), jointly evaluated with ASE for Indium metal TIM integration.
The work demonstrates a production-oriented approach to BSM that combines strong reliability performance with scalable, atmospheric processing — without the need for vacuum equipment.
Join our technical presentation:
Spray Deposited MOD Silver BSM Demonstrates Production-ready Performance for Indium Metal TIM Integration White Enabling Scalable Atmospheric Processing.
Speaker: Dr. Kang-Yu Liu, Taiwan Application Development Manager, Electroninks
Date: Wednesday, September 30, 2026
Time: 4:00-4:25 PM
Location: Cezanne 1-2, Encore Boston Harbor
For advanced RF, logic, and high-power packages, our approach offers a potential path to reduce vacuum-processing requirements and capital constraints while maintaining the reliability needed for advanced thermal management.
If you’ll be attending IMAPS, we’d love to connect.
Visit us at booth #418
Learn more about Electroninks at https://electroninks.com/
We look forward to seeing you in Boston!
Thank you,
Avery Gerber, Sales and Marketing Associate
7901 E. Riverside Dr. | Building 1, Unit 150
Austin, Texas 78744
Office: 512-766-7555 | Direct: (512) 790-0995
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by "Avery Gerber" <A.Gerber@electroninks.com> - 02:33 - 25 Sep 2026