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ECTC Early Bird Registration Rates ends on 8 May
The premier international packaging, components, and microelectronics systems technology conference͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ To view this email as a webpage, click here.
ECTC 2026 Registration Ends on 8 May!
The premier international conference for electronics packaging, components, and microelectronics systems technology.
ECTC brings together more than 2,000 professionals from across the global microelectronics and semiconductor packaging industry, including manufacturers, design houses, foundries, material suppliers, universities, and investors. This year the ECTC has over 450 technical papers covering advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high-speed and high-bandwidth, photonics, quantum electronics, flexible and printed electronics.
[ Attendees queuing and interacting with staff at a busy registration desk for ECTC 2025, featuring stacks of conference bags. ]Registration Patron: Zymet
The ECTC 2026 Program Includes:
- 41 technical sessions with a total number of approximately 450 technical papers including:
- 5 interactive presentation sessions, one of which is a student session
- 1 Keynote Speaker
- 12 special invited sessions plus a Young Professionals event
- 16 CEU-approved Professional Development Courses
- Student engagement programs to support workforce development
- Start-up Innovation Challenge
- ECTC Undergraduate/Master and PhD Students competition
- Thursday ECTC Reception Gala
With multiple opportunities for networking and a Technology Corner Exhibit that showcases industry-leading product and service companies from around the world, the ECTC is where you belong.
To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.
Special Sessions and Panels
2025 ECTC Keynote Talk
Chair: Michael Mayer, University of Waterloo
[ Image ]Keynote Speaker: Tien Wu, CEO of Advanced Semiconductor Engineering, Inc
Abstract
Advanced Packaging and the Future of System Optimization
Global AI infusion is redefining performance, power, and integration requirements, placing advanced packaging at the forefront of semiconductor innovation. As chip architecture complexity increases, the industry is progressing beyond device-level scaling toward system-level optimization. Advances in heterogeneous integration and packaging-enabled co-design are shaping more efficient, scalable, and resilient systems. Moving forward, system-centric strategies that align architecture, packaging, and collaboration across the ecosystem are paramount to shaping the golden era of AI and semiconductors.
2026 IEEE EPS President’s Panel Session - Data Centers in the Age of AI: Challenges and Solutions
Session Organizers:
Jeff Suhling, Auburn University; David McCann, Amkor; Benson Chan, Binghamton University
Panel Moderator:
Kanad Ghose, Binghamton University
ECTC 2026 Plenary Session: Efficiency Is Not Enough:
Are We Solving the Wrong Problem in the Data Center Energy Use?
Session Chairs:
Masha Gorchichko, Marvell Technology, Inc.
Jan Vardaman, TechSearch International, Inc.
Special Session 1: Quantum Infrastructure for AI Applications: Packaging Challenges and Roadmap
Session Chairs:
Rabindra N. Das, MIT Lincoln Laboratory
Pavel Roy Paladhi, NVIDIA
Special Session 2: New Packaging Technologies Enabled by Panel-Level IntegrationSession Chairs:
Venkata RSS Mokkapati, AT&S AG
Markus Leitgeb, AT&S AG
Rozalia Beica, Rapidus
Sponsored by Applied Materials and Rapidus Design Solutions
Special Session 3: AI-Enabled Electronic Design Automation for Multi-Physics Advanced Packaging
Session Chairs:
Ian O'Connor, University of Lyon - Lyon Institute of Nanotechnology
Jose Schutt-Aine, University of Illinois
Special Session 4: Photonics-Based Systems for AI and Exascale Computing
Session Chairs:
Stephane Bernabe, CEA-LETI
Lars Brusberg, Corning Inc.
Special Session 5: System Integration Challenges of Large-Size and High-Power Components for High-Performance Computing and AI Applications
Session Chairs:
Tae-Kyu Lee, Cisco Systems, Inc.
Mike Gallagher, Qnity Electronics
Sponsored by ZymetSpecial Session 6: Electrical-Thermal-Mechanical Co-Design in High-Performance Packaging
Session Chairs:
Ning Ye, Sandisk Technologies, Inc.
Tiwei Wei, University of California, Los Angeles
Sponsored by Zymet
Special Session 7: Enabling Next-Generation Advanced Packaging Technology from Wafer to Panel
Session Chairs:
Kuldip Johal, MKS Instruments
Beth Keser, Volantis Semiconductor
Lihong Chao, ASE
Sponsored by Binghamton UniversitySpecial Session 8: Innovative Materials for Advanced Packaging – Materials for Packaging, Integration, and Performance
Session Chairs:
Zia Karim, Yield Engineering Systems
Ksenija Varga, EV Group
2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop
Session Chairs:
Ravi Mahajan, Intel Corporation
William Chen, ASE
Subu Iyer, UCLA
Anne Meixner, HIR Fellow
Benson Chan, Binghamton University
Rockwell Hsu, Cisco Systems
Jose Schutt-Aine, UIUC
Sponsored by Microsanj
2026 ECTC Young Professional Networking Event
Session Chair: Aakrati Jain, IBM
2026 IEEE EPS Seminar: Redefining System Integration:
The Rise of Organic Substrates in the Chiplet Era
Session Chairs:
Takashi Hisada, Rapidus Corporation
Yasumitsu Orii, Rapidus Corporation
ECTC 2026 Student Challenge
Session Chairs:
Przemyslaw Gromala, Robert Bosch Kft
Ibrahim Guven, Virginia Commonwealth University
Start Up Competition: The Light Age:Strategic Investment in Photonics to Power the Next Computing Era
Session Chairs:
Rozalia Beica, Rapidus Design Solutions
Farhang Yazdani, BroadPak Corporation
Professional Development Courses
PDC Chairs:
Kitty Pearsall, Capstan Technologies, Inc.
Jeff Suhling, Auburn University
MORNING COURSES 8:00 AM – 12:00 PM
Visit the ECTC PDC page for full description on the courses and instructor’s bio.
1. High Reliability Soldering in Advanced Semiconductor Packaging
Course Leader: Ning-Cheng Lee, ShinePure Hi-Tech
2. Photonic Components and Packaging Technologies for Data Center, Communication, Sensing, and Displays
Course Leader: Torsten Wipiejewski, Huawei Technologies Duesseldorf GmbH
3. Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging
Course Leader: Viorel Dragoi, EV Group
4. Introduction to Quality and Reliability Engineering of Advanced Microelectronics Packaging
Course Leaders: Shubhada Sahasrabudhe, QuRIuS LLC; Shalabh Tandon, QuRIuS LLC
5. 2.5D/3D Package Failure Analysis - Failure Mechanisms and Analytical Tools
Course Leader: Deepak Goyal, Carl Zeiss, Inc.
6. AI-Applications in Semiconductor Packaging
Course Leader: Pradeep Lall, Auburn University
7. Fundamentals of Fabrication Processes and RF Design of Advanced Packages Including Fan-Out, Chiplets, Glass and Polymer Interposers
Course Leaders: Ivan Ndip, Brandenburg University of Technology/Fraunhofer IZM; Markus Woehrmann, Fraunhofer IZM
8. Electronics Cooling and Reliability for Data Centers
Course Leader: Patrick McCluskey, University of Maryland, College ParkAFTERNOON COURSES 1:30 PM – 5:30 PM
9. Polymers for Advanced Packaging
Course Leader: Jeff Gotro, InnoCentrix, LLC
10: Diamond Heat Spreaders and Heterogeneous Integration
Course Leader: Joana-Catarina Mendes, Instituto de Telecomunicaciones
11: Advanced Packaging for Chiplet, Heterogeneous Integration, and Co-Packaged Optics
Course Leader: John H. Lau, Unimicron Technology Corp.
12: Preventing Packaging Failure - Modeling and Mitigation Strategies for Warpage, Fatigue, and Thermal Issues
Course Leader: Xuejun Fan, Lamar University
13: Failure Analysis of Engineering Materials for Advanced Electronic Packaging
Course Leader: Kuan Yew Cheong, Universiti Sains Malaysia
14: Flip Chip Technologies
Course Leader: Shengmin Wen, TATA Electronics Private Limited
15: Advanced Packaging for 5G/6G - RF Focus
Course Leader: Premjeet Chahal, Michigan State University
16: Thermal Management in the Age of AI
Course Leader: Jaime Sanchez, Lightmatter, Inc
Come to ECTC and Visit More Than 135 Exhibitors
The ECTC Exhibition will showcase more than 135 companies and organizations representing the full spectrum of materials, services, equipment, and products for the electronic packaging industry. Complementing the strength of the ECTC technical program, the Exhibition provides an unparalleled opportunity for engineers and decision makers to discuss and collaborate with representatives from leading electronic packaging companies.
For more information on exhibiting opportunities, contact Chris Bower, ECTC Exhibits Chair.
Conference Location
[ Aerial view of a grand resort complex featuring two large hotels, a winding lake, and a golf course under a clear blue sky. ]JW Marriott & The Ritz-Carlton Grande Lakes Resort
4040 Central Florida Parkway,
Orlando, Florida, USA, 32837Rooms have opened up at the Ritz hotel. ECTC room rate closes on 8 May. For more information on booking a hotel room please visit our website.
For more information on the 2026 ECTC visit www.ectc.net.
Also, see some of the 2025 ECTC Highlights.
Learn more about the packaging innovations and the ECTC role over the last 75 years here.
Become an ECTC Sponsor: Don't miss this great opportunity!
See ECTC pictures via Flickr and be sure to join the ECTC via LinkedIn.
Thanks to Our 2026 Sponsors
[ Event sponsors organized by category: Gala Reception (Koh Young), Registration (Zymet), Program (UTechZone), Conference App (Zymet), Best Student Paper (Intel), Student Reception (Texas Instruments), Lanyard (HD MicroSystems), Silver Sponsors (Ajinomoto, UYEMURA, SCREEN, STATSChipPAC, tok), and Special Session (SIP, Zymet). ] [[https://ectc.net/sponsors/]]Website | Privacy Policy | Contact
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A public charity, IEEE is the world’s largest technical professional
organization dedicated to advancing technology for the benefit of humanity.If you have an IEEE Account, manage your IEEE communications preferences here. Users without an IEEE Account can access the Privacy Portal to view selected preferences and policies.
[ wedge ]IEEE • 445 Hoes Lane, Piscataway, NJ 08854 USA
por "IEEE Electronics Packaging Society" <ieee-eps@deliver.ieee.org> - 11:06 - 30 abr. 2026 - 41 technical sessions with a total number of approximately 450 technical papers including:
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por "USPS Informed Delivery" <USPSInformeddelivery@email.informeddelivery.usps.com> - 10:32 - 30 abr. 2026 -
Keep Work Moving: WIP, Workstations & Smarter Flow
Keep Work Moving: WIP, Workstations & Smarter Flow
Explore practical ways to reduce unnecessary handling, improve workstation flow, and keep parts closer to where the work happens. ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ Too Much WIP? Too Little WIP? Both Slow You Down
Finding the right balance between stocked, moving, and waiting parts is critical to keeping production flowing.
See how modular WIP carts can help control buffers, protect parts, and reduce unnecessary handling between workstations.
Youtube
Workstation + Flow Rack: One Smart Build
When parts need to stay close to the work area, an integrated flow rack can make a big difference.
In this video, Esteban presents a modular assembly workstation built with roller tracks, wheel guides, and a stable bottom track to keep bins moving smoothly and operators focused on the task.
Technical data
Don’t Let the Coating Fool You
Flexpipe pipes may look lightweight because of their clean polyethylene coating, but the strength comes from the cold-rolled carbon steel tube inside.
This article answers one of the most common questions we hear from new users: how strong is Flexpipe, and what design factors affect load capacity?Online tools
FREE PDF: Karakuri Kaizen Guide
Discover how simple mechanical systems can help move parts, reduce handling, and improve flow without complex automation.
Get practical examples and tips to start identifying Karakuri opportunities in your facility.
“Without standards, there can be no improvement.”- Taiichi Ohno
FLEXPIPE, 33 Rue Racine, Farnham, Quebec J2N 3A3, Canada
por "The Flexpipe Team" <content@flexpipeinc.com> - 10:31 - 30 abr. 2026 -
Fwd: FW: New nLight PO US2034713
Did you see this order? Looks like they just sent it to me?---------- Forwarded message ---------
From: Iain C Brown <iain.c.brown@nlight.net>
Date: Thu, Apr 30, 2026 at 6:23 AM
Subject: FW: New nLight PO US2034713
To: cberger@turnpack.com <cberger@turnpack.com>, Barbara Clarke <barbara.clarke@nlight.net>
Cc: Iain C Brown <iain.c.brown@nlight.net>Hello,
I’m not seeing a reply to this email (if I’m missing it, apologies), please provide delivery date
Thanks
Iain
From: Iain C Brown
Sent: Tuesday, February 24, 2026 5:16 PM
To: Barbara Clarke <barbara.clarke@nlight.net>; 'cberger@turnpack.com' <cberger@turnpack.com>
Cc: Iain C Brown <iain.c.brown@nlight.net>
Subject: New nLight PO US2034713Hello,
Please find attached a new nLight PO, please review, and confirm receipt and delivery date (if applicable), Early deliveries are OK.
Thanks
Iain
--Christopher Berger
por Chris Berger - 10:17 - 30 abr. 2026 -
Invoice #INV2026030007 marked as Paid by Intuitive
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Invoice #INV2026030007 marked as Paid by Intuitive
Hello Supplier,
Your Invoice has been marked as 'Paid' by your customer, Intuitive.
If you have any questions you can simply contact your customer through normal channels or enter a comment on the Invoice.
View Invoice Never Miss an Invoice with Coupa
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por do_not_reply@intuitive.coupahost.com - 10:12 - 30 abr. 2026 -
PO 106501 C of C needed
Good morning,
Can you please send me the C of C's for PO 106501 item J1-T2-BP that delivered this week.
Thank you,
Tiffany Harding
Procurement Manager
491 E 350 N
Gunnison, UT 84634
P: 855.450.7300 ext 308
tiffany.harding@proteor.com | www.proteor.com
por "Tiffany Harding" <Tiffany.Harding@proteor.com> - 10:06 - 30 abr. 2026 -
AESDirect Unscheduled Outage
AESDirect Unscheduled Outage
AESDirect Unscheduled Outage
April 30, 2026
This message is intended for ACE AESDirect filers ONLY. If you are not an ACE AESDirect filer, you are not affected by this outage.
The outage is effective immediately.
ACE AESDirect filers may submit shipments under the AES Downtime Policy. Please note, licensable shipments cannot be exported under the AES Downtime Policy and must be held until the connection is restored and an Internal Transaction Number (ITN) is received. Once connection is brought back on-line after the outage, all shipments that were exported under the AES Downtime Policy must be filed along with any new AES transactions.
If you use the AES Downtime Policy for export, please contact the port from which you will be exporting. In lieu of the AES Proof of Filing citation, please use the AES Downtime citation, which consists of the phrase AESDOWN, your individual company's Filer ID, followed by the date.
For example: AESDOWN 123456789 04/30/2026
Please see the CBP web site for further information on the AES Downtime Policy:
https://www.cbp.gov/document/guidance/aes-downtime-guidelines
For further information or questions, contact the U.S. Census Bureau’s Trade Data Collection Branch.Telephone: (800) 549-0595, select option 1 for AES
Email: askaes@census.gov
Online: www.census.gov/trade
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We serve as the nation’s leading provider of quality data about its people and economy. The Census Bureau is the federal government's largest statistical agency. As the world’s premier statistical agency, we are dedicated to making our nation a better place. Policy-makers, businesses, and the public use our data to make informed decisions.
Stay connected with us!
Join the conversation on social media.




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por "DMARC Aggregate Report" <dmarcreport@microsoft.com> - 07:51 - 30 abr. 2026 -
AESDirect is Currently Experiencing Issues
AESDirect is Currently Experiencing Issues
AESDirect is Currently Experiencing Issues
April 30, 2026
Please note, an issue with AESDirect (Submit AES Filing) has been reported, and the application is not properly functioning for users.
The U.S. Census Bureau and U.S. Customs and Border Protection (CBP) are working together to determine the cause and resolution for the problem. Additional guidance will be provided if the issue persists.
Please be aware that we may be experiencing a higher volume of inquiries while the issue persists.
If you have questions, please contact the Trade Data Collection Branch at 1-800-549-0595, using option 1 or email askaes@census.gov.Help us spread the word about Census Bureau data!
Share this on social media or forward it to a friend.
Share This About the Census Bureau
We serve as the nation’s leading provider of quality data about its people and economy. The Census Bureau is the federal government's largest statistical agency. As the world’s premier statistical agency, we are dedicated to making our nation a better place. Policy-makers, businesses, and the public use our data to make informed decisions.
Stay connected with us!
Join the conversation on social media.




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Proof of Service Deprecation for SAP Business Network (EVC2270461)
SAP Communication

Notice of Planned Deprecation
Proof of Service Deprecation for SAP Business Network

Dear Customers,
This notice is to inform you that SAP Business Network will sunset the Proof of Service capability. This functionality acts as a digital record as proof of completed service in the services procurement process.
This change will take effect on the July 30, 2026.
Please do not reply to this email as this mailbox is not monitored.
Thank you,
Release Readiness Team | SAP Business NetworkIMPORTANT NOTE
This notice reflects SAP planning as of the date of this notice. SAP may change the features and release schedule at any time without notice and assumes no responsibility for errors or omissions. Nothing in this notice should be construed to represent any commitment by SAP to include any specific new features in any version of the SAP solutions. All dates in this communication are based on US Pacific Time.Notice Date: 30 April 2026

Product Name Affected Entity SAP Business Network SAP Business Network Discovery
SAP Business Network for Procurement
SAP Business Network for Suppliers
SAP Business Network for Supply Chain
SAP Integration Suite, managed gateway for spend management and SAP Business Network
Questions
Please contact SAP Support by visiting Help Center.

Let's Run Better Together!
Your SAP Team

SAP SE | Dietmar-Hopp-Allee 16 | 69190 Walldorf | Germany
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por "SAP CloudSupport Alerts" <sapcloudsupport@alerts.ondemand.com> - 06:32 - 30 abr. 2026 -
Report Domain: turnpack.com Submitter: verizon.net Report-ID: <1777532969.166598>
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por noreply@dmarc.yahoo.com - 06:06 - 30 abr. 2026 -
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por "DMARC Aggregate Report" <dmarcreport@microsoft.com> - 04:56 - 30 abr. 2026 -
Third-Party Audit Notification
Your Message Subject or Title
April 30, 2026Dear Supplier,Apple has engaged APEX Analytix, an independent third-party provider, to conduct post-payment audits, including the identification of potential duplicate payments and unclaimed credit memos.
You may receive requests directly from the APEX Analytix team using the domain @apexanalytix.com. Please note that these communications are legitimate and authorized by Apple.
Please do not reply to this email. If you have any questions, please reply to the request you receive from apreview@apple.apexanalytix.com. The request code on the Apex outreach will help with a proper response to your question.
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Apple Accounts PayableCopyright © 2026 Apple Inc. All rights reserved.
por "Apple" <noreply@apple.com> - 03:47 - 30 abr. 2026 -
Your shipment was delivered 870502409643
FedEx
We've included the delivery details for you
Your shipment was delivered. Delivery Date Thu, 04/30/2026
11:23am
Received by S.JIANKONGSHIMENKOU Report missing package How was your international shipping experience?
Personal message Your Purchase Order D260331001 is in this shipment. Tracking details Tracking ID 870502409643 From CHRISTOPHER BERGER
22425 S SCOTLAND CT
SUITE 104
QUEEN CREEK, AZ, US
85142To ATTN: STELLA JAU
4E ORIENTAL FINANCIAL PARK
NO. 2981 DONGFANG ROAD
Pudong District
SHANGHAICN
200125Ship date Fri 4/24/2026 01:18 PM Number of pieces 1 Total shipment weight 1.00 LB Service FedEx International Economy Reference SO26101031 Shipper reference SO26101031 Invoice number INV/2026/04/0003 Purchase order number D260331001 TRACK SHIPMENT This tracking update has been requested by: Company name christopher berger Name Turnpack LLC Email info@turnpack.com
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ID 1026
por "FedEx Tracking" <TrackingUpdates@fedex.com> - 11:31 - 29 abr. 2026 -
Your shipment is out for delivery today 870502409643
FedEx
Your shipment is scheduled to arrive today.
Your shipment is out for delivery today. Scheduled delivery Estimated between 10:30am and 2:30pm
Take more control of your shipments Save delivery instructions, get picture proof of delivery, and more. MANAGE DELIVERY Some delivery options might not be available on the day of delivery. Personal message Your Purchase Order D260331001 is in this shipment. Tracking details Tracking ID 870502409643 From CHRISTOPHER BERGER
22425 S SCOTLAND CT
SUITE 104
QUEEN CREEK, AZ, US
85142To ATTN: STELLA JAU
4E ORIENTAL FINANCIAL PARK
NO. 2981 DONGFANG ROAD
Pudong District
SHANGHAICN
200125Ship date Fri 4/24/2026 01:18 PM Number of pieces 1 Total shipment weight 1.00 LB Service FedEx International Economy Reference SO26101031 Shipper reference SO26101031 Invoice number INV/2026/04/0003 Purchase order number D260331001 TRACK SHIPMENT This tracking update has been requested by: Company name christopher berger Name Turnpack LLC Email info@turnpack.com
Please do not respond to this message. This email was sent from an unattended mailbox. This report was generated at approximately 9:12 PM CDT 04/29/2026.All weights are estimated.
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© 2026 Federal Express Corporation. The content of this message is protected by copyright and trademark laws under U.S. and international law. Review our Privacy Notice. All rights reserved.
Thank you for your business.
ID 1021
por "FedEx Tracking" <TrackingUpdates@fedex.com> - 10:12 - 29 abr. 2026 -
Report Domain: turnpack.com Submitter: reports.emailsrvr.com Report-ID: 756963e1-6850-46a0-916a-13806e499
por "DMARC Report" <dmarc_reports@reports.emailsrvr.com> - 10:07 - 29 abr. 2026 -
Remittance Information from Intuitive Surgical
New Zix secure email message from Wells Fargo Do not reply to this notification message; this message was auto-generated by the sender's security system.
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por "paymentremittanceinformation wellsfargo.com" <paymentremittanceinformation@wellsfargo.com> - 08:26 - 29 abr. 2026 -
Re: Document Request : ComEt
Hi Chris,It let me upload 1 small text file, but would not accept the larger files.On Wednesday, April 29, 2026 at 03:45:11 PM EDT, Chris Berger <info@turnpack.com> wrote:Document Request:
ComEt
Hello stu_gilson@verizon.net,
Chris Berger ("Christopher Berger" <cberger@turnpack.com>) asks you to provide the following document:
ComEtHi Stu,
Can you try this? I tried it with a 50MB document myself and it worked, hopefully it won't choke on 2GB, otherwise I'll have to sign up for a DropBox trial.
Chris
Please provide us with the missing document before the link expires (planned on 2026-05-29).

Christopher Berger
Turnpack, LLC +1 480-331-1878 | info@turnpack.com | https://www.turnpack.com This link expires on 2026-05-29.
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por stu_gilson@verizon.net - 04:06 - 29 abr. 2026 -
Delivered: "EEMB LS14250 3.6V 1/2 AA..." and 2 more items
Delivered: "EEMB LS14250 3.6V 1/2 AA..." and 2 more items͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ ͏ Your package was delivered!Delivered todayIt was handed directly to a receptionist or someone at a front desk.Turnpack - QUEEN CREEK, AZ - On behalf of TurnpackOrder # 112-2095490-3821064
Return or replace items in Your Orders. 
por "Amazon.com" <order-update@amazon.com> - 03:26 - 29 abr. 2026












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